1/11
Table 1: Main Features
DESCRIPTION
Available either in sensitive (TS12) or standard
(TN12 / TYN) gate triggering levels, the 12A SCR
series is suitable to fit all modes of control, found
in applications such as overvoltage crowbar
protection, motor control circuits in power tools
and kitchen aids, inrush current limiting circuits,
capacitive discharge ignition and voltage
regulation circuits...
Available in through-hole or surface-mount
packages, they provide an optimized performance
in a limited space area.
Symbol
Value
Unit
I
T(RMS)
12
A
V
DRM
/V
RRM
600 to 1000
V
I
GT
0.2 to 15
mA
TN12, TS12 and TYNx12 Series
12A SCR
S
REV. 5
October 2005
SENSITIVE & STANDARD
Table 2: Order Codes
Part Numbers
Marking
TN1215-x00B
TN1215x00
TN1215-x00B-TR
TN1215x00
TN1215-x00G
TN1215x00G
TN1215-x00G-TR
TN1215x00G
TN1215-x00H
TN1215x00
TS1220-x00B
TS1220x00
TS1220-x00B-TR
TS1220x00
TS1220-x00H
TS1220x00
TYNx12RG
TYNx12
TYNx12TRG
TYNx12T
A
A
K
G
A
K
G
A
IPAK
(TN12-H / TS12-H)
TO-220AB
(TYNx12RG)
A
K
G
A
K
G
A
A
K
G
A
DPAK
(TN12-B / TS12-B)
D
2
PAK
(TN12-G)
TN12, TS12 and TYNx12 Series
2/11
Table 3: Absolute Ratings (limiting values)
Tables 4: Electrical Characteristics (T
j
= 25C, unless otherwise specified)
SENSITIVE
Symbol
Parameter
Value
Unit
TN12-G
TYN12
TN12-B/H
TS12-B/H
I
T(RMS)
RMS on-state current (180 conduction angle)
T
c
= 105C
12
A
IT
(AV)
Average on-state current (180 conduction
angle)
T
c
= 105C
8
A
I
TSM
Non repetitive surge peak on-
state current
t
p
= 8.3 ms
T
j
= 25C
145
115
A
t
p
= 10 ms
140
110
I
t
I
t Value for fusing
t
p
= 10 ms
T
j
= 25C
98
60
A
2S
dI/dt
Critical rate of rise of on-state
current I
G
= 2 x I
GT
, t
r
100 ns F = 60 Hz
T
j
= 125C
50
A/s
I
GM
Peak gate current
t
p
= 20 s
T
j
= 125C
4
A
P
G(AV)
Average gate power dissipation
T
j
= 125C
1
W
T
stg
T
j
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 125
C
V
RGM
Maximum peak reverse gate voltage (for TN12 & TYN12 only)
5
V
Symbol
Test Conditions
TS1220
Unit
I
GT
V
D
= 12 V R
L
= 140
MAX.
200
A
V
GT
MAX.
0.8
V
V
GD
V
D
= V
DRM
R
L
= 3.3 k
R
GK
= 1 k
T
j
= 125C
MIN.
0.1
V
V
RG
I
RG
= 10 A
MIN.
8
V
I
H
I
T
= 50 mA R
GK
= 1 k
MAX.
5
mA
I
L
I
G
= 1 mA R
GK
= 1 k
MAX.
6
mA
dV/dt
V
D
= 65 % V
DRM
R
GK
= 220
T
j
= 125C
MIN.
5
V/s
V
TM
I
TM
= 24 A tp = 380 s
T
j
= 25C
MAX.
1.6
V
V
t0
Threshold voltage
T
j
= 125C
MAX.
0.85
V
R
d
Dynamic resistance
T
j
= 125C
MAX.
30
m
I
DRM
I
RRM
V
DRM
= V
RRM
R
GK
= 220
T
j
= 25C
MAX.
5
A
T
j
= 125C
2
mA
TN12, TS12 and TYNx12 Series
3/11
STANDARD
Table 6: Thermal resistance
Symbol
Test Conditions
TN1215
TYN
Unit
B / H
G
x12T
x12
I
GT
V
D
= 12 V R
L
= 33
MIN.
2
0.5
2
mA
MAX.
15
5
15
V
GT
MAX.
1.3
V
V
GD
V
D
= V
DRM
R
L
= 3.3 k
T
j
= 125C
MIN.
0.2
V
I
H
I
T
= 500 mA Gate open
MAX.
40
30
15
30
mA
I
L
I
G
= 1.2 I
GT
MAX.
80
60
30
60
mA
dV/dt
V
D
= 67 % V
DRM
Gate open T
j
=125C
MIN.
200
40
200
V/s
V
TM
I
TM
= 24 A t
p
= 380 s
T
j
= 25C
MAX.
1.6
V
V
t0
Threshold voltage
T
j
= 125C
MAX.
0.85
V
R
d
Dynamic resistance
T
j
= 125C
MAX.
30
m
I
DRM
I
RRM
V
DRM
= V
RRM
T
j
= 25C
MAX.
5
A
T
j
= 125C
2
mA
Symbol
Parameter
Value
Unit
R
th(j-c)
Junction to case (DC)
1.3
C/W
R
th(j-a)
Junction to ambient (DC)
S = 0.5 cm
DPAK
70
C/W
S = 1 cm
D
2
PAK
45
IPAK
100
TO-220AB
60
S = Copper surface under tab.
Figure 1: Maximum average power dissipation
versus average on-state current
Figure 2: Average and D.C. on-state current
versus case temperature
0
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
7
8
9
10
11
12
P(W)
I
(A)
T(AV)
= 180
360
0
25
50
75
100
125
0
2
4
6
8
10
12
14
I
(A)
T(AV)
T
(C)
case
= 180
D.C.
TN12, TS12 and TYNx12 Series
4/11
Figure 3: Average and D.C. on-state current
versus ambient temperature (device mounted
on FR4 with recommended pad layout) (DPAK)
Figure 4: Relative variation of thermal
impedance junction to case versus pulse
duration
Figure 5: Relative variation of thermal
impedance junction to ambient versus pulse
duration (recommended pad layout, FR4 PC
board for DPAK)
Figure 6: Relative variation of gate trigger
current and holding current versus junction
temperature for TS8 series
Figure 7: Relative variation of gate trigger
current and holding current versus junction
temperature for TN8 & TYN08 series
Figure 8: Relative variation of holding current
versus gate-cathode resistance (typical
values) for TS8 series
0
25
50
75
100
125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
I
(A)
T(AV)
T
(C)
amb
= 180
D.C.
D PAK
2
DPAK
1E-3
1E-2
1E-1
1E+0
0.1
0.2
0.5
1.0
K=[Z
/R
th(j-c)
th(j-c)
]
t (s)
p
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
0.01
0.10
1.00
K=[Z
/R
th(j-a)
th(j-a)
]
t (s)
p
DPAK
TO-220AB / IPAK
D PAK
2
-40
-20
0
20
40
60
80
100
120
140
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
T (C)
j
I
,I ,I [T ] /
GT H L
j
I
,I ,I [T =25C]
GT H L
j
I
GT
I
H
& I
R
= 1k
L
GK
-40
-20
0
20
40
60
80
100
120
140
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
I
,I ,I [T ] /
GT H L
j
I
,I ,I [T =25C]
GT H L
j
T (C)
j
I
GT
I
H
& I
L
1E-2
1E-1
1E+0
1E+1
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
R
(k )
GK
I [R
] / I [
=1k ]
H
GK
H
R
GK
T
j
= 25C
TN12, TS12 and TYNx12 Series
5/11
Figure 9: Relative variation of dV/dt immunity
versus gate-cathode resistance (typical
values) for TS8 series
Figure 10: Relative variation of dV/dt immunity
versus gate-cathode capacitance (typical
values) for TS8 series
Figure 11: Surge peak on-state current versus
number of cycles
Figure 12: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp < 10 ms, and corresponding values of It
Figure 13: On-state characteristics (maximum
values)
Figure 14: Thermal resistance junction to
ambient versus copper surface under tab
(epoxy printed circuit board FR4, copper
thickness: 35m) (DPAK and D
2
PAK)
0
200
400
600
800
1000
1200
0.1
1.0
10.0
R
(k )
GK
dV/dt[R
] / dV/dt[
=220 ]
GK
R
GK
T
j
= 125C
V = 0.67 x V
D
DRM
0
25
50
75
100
125
150
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
C
(nF)
GK
dV/dt[C
] / dV/dt[
=220 ]
GK
R
GK
T
V = 0.67 x V
= 125C
R
= 220
D
DRM
GK
j
1
10
100
1000
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
I
(A)
TSM
Number of cycles
Non repetitive
T initial=25C
j
Repetitive
T =105C
C
TS12
TN12 / TYN12
t =10ms
p
One cycle
0.01
0.10
1.00
10.00
10
100
1000
2000
I
(A), I t (A s)
TSM
2
2
t (ms)
p
I t
2
I
TSM
T initial = 25C
j
TS12
TS12
TN12 / TYN12
TN12 / TYN12
dI/dt limitation
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1
10
100
200
I
(A)
TM
V
(V)
TM
T
j
=max
T =25C
j
V =0.85V
R =30m
T max.:
j
t0
d
0
2
4
6
8
10
12
14
16
18
20
0
20
40
60
80
100
S(cm)
R
(C/W)
th(j-a)
DPAK
D PAK
2
TN12, TS12 and TYNx12 Series
6/11
Figure 15: Ordering Information Scheme (TN8 series)
Figure 16: Ordering Information Scheme (TS8 series)
Figure 17: Ordering Information Scheme (TYN08 series)
TN 12 15 - 600 B (-TR)
Standard SCR series
Sensitivity
Voltage
Package
Packing mode
Current
12 = 12A
D PAK)
15 = 15mA
600 = 600V
800 = 800V
1000 = 1000V
B = DPAK
G = D PAK
H = IPAK
Blanck = Tube
-TR = Tape & Reel (DPAK and
2
2
TS 12 20 - 600 B (-TR)
Sensitive SCR series
Sensitivity
Voltage
Package
Packing mode
Current
12 = 12A
20 = 200A
600 = 600V
700 = 700V
B = DPAK
H = IPAK
Blanck = Tube
-TR = Tape & Reel
TYN 6 12
T RG
Standard SCR series
Packing mode
Voltage
Current
Sensitivity
6 = 600V
8 = 800V
10 = 100V
12 = 12A
Blanck = 30mA
T = 15mA
RG = Tube
TN12, TS12 and TYNx12 Series
7/11
Table 7: Product Selector
Figure 18: DPAK Package Mechanical Data
Figure 19: DPAK Foot Print Dimensions
(in millimeters)
Part Numbers
Voltage (xxx)
Sensitivity
Package
600 V
700 V
800 V
1000 V
TN1215-xxxB
X
X
15 mA
DPAK
TN1215-xxxG
X
X
X
15 mA
D
2
PAK
TN1215-xxxH
X
X
15 mA
IPAK
TS1220-xxxB
X
X
0.2 mA
DPAK
TS1220-xxxH
X
X
0.2 mA
IPAK
TYNx12
X
X
X
15 mA
TO-220AB
TYNx12T
X
X
X
5 mA
TO-220AB
H
L4
G
B
L2
E
B2
D
A1
R
R
C
A
C2
0.60 MIN.
V2
A2
6.7
6.7
3
3
1.6
1.6
2.3
2.3
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max
Min.
Max.
A
2.20
2.40
0.086
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.212
C
0.45
0.60
0.017
0.023
C2
0.48
0.60
0.018
0.023
D
6.00
6.20
0.236
0.244
E
6.40
6.60
0.251
0.259
G
4.40
4.60
0.173
0.181
H
9.35
10.10
0.368
0.397
L2
0.80 typ.
0.031 typ.
L4
0.60
1.00
0.023
0.039
V2
0
8
0
8
TN12, TS12 and TYNx12 Series
8/11
Figure 20: D
2
PAK Package Mechanical Data
Figure 21: D
2
PAK Foot Print Dimensions
(in millimeters)
G
L
L3
L2
B
B2
E
2mm min.
FLAT ZONE
A
C2
D
R
A2
V2
C
A1
16.90
10.30
8.90
3.70
5.08
1.30
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
4.30
4.60
0.169
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.25
1.40
0.048 0.055
C
0.45
0.60
0.017
0.024
C2
1.21
1.36
0.047
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.28 0.393
0.405
G
4.88
5.28
0.192
0.208
L
15.00
15.85 0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
R
0.40
0.016
V2
0
8
0
8
TN12, TS12 and TYNx12 Series
9/11
Figure 22: IPAK Package Mechanical Data
Figure 23: TO-220AB Package Mechanical Data
H
L
L1
G
e
B5
B
V1
D
C
A1
A3
A
C2
B3
L2
E
B2
C
b2
c2
F
I
L
A
a1
a2
B
e
b1
I4
l3
l2
c1
M
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
2.20
2.40
0.086
0.094
A1
0.90
1.10
0.035
0.043
A3
0.70
1.30
0.027
0.051
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.212
B3
0.95
0.037
B5
0.30
0.035
C
0.45
0.60
0.017
0.023
C2
0.48
0.60
0.019
0.023
D
6
6.20
0.236
0.244
E
6.40
6.60
0.252
0.260
e
2.28
0.090
G
4.40
4.60
0.173
0.181
H
16.10
0.634
L
9
9.40
0.354
0.370
L1
0.8
1.20
0.031
0.047
L2
0.80
1
0.031 0.039
V1
10
10
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
15.20
15.90 0.598
0.625
a1
3.75
0.147
a2
13.00
14.00 0.511
0.551
B
10.00
10.40 0.393
0.409
b1
0.61
0.88
0.024
0.034
b2
1.23
1.32
0.048
0.051
C
4.40
4.60
0.173
0.181
c1
0.49
0.70
0.019
0.027
c2
2.40
2.72
0.094
0.107
e
2.40
2.70
0.094
0.106
F
6.20
6.60
0.244
0.259
I
3.75
3.85
0.147
0.151
I4
15.80 16.40 16.80 0.622 0.646 0.661
L
2.65
2.95
0.104
0.116
l2
1.14
1.70
0.044
0.066
l3
1.14
1.70
0.044
0.066
M
2.60
0.102
TN12, TS12 and TYNx12 Series
10/11
In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 8: Ordering Information
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
TN1215-x00B
TN1215x00
DPAK
0.3 g
75
Tube
TN1215-x00B-TR
TN1215x00
DPAK
0.3 g
2500
Tape & reel
TN1215-x00G
TN1215x00G
D
2
PAK
1.5 g
50
Tube
TN1215-x00G-TR
TN1215x00G
D
2
PAK
1.5 g
1000
Tape & reel
TN1215-x00H
TN1215x00
IPAK
0.3 g
75
Tube
TS1220-x00B
TS1220x00
DPAK
0.3 g
75
Tube
TS1220-x00B-TR
TS1220x00
DPAK
0.3 g
2500
Tape & reel
TS1220-x00H
TS1220x00
IPAK
0.3 g
75
Tube
TYNx12RG
TYNx12
TO-220AB
2.3 g
50
Tube
TYNx12TRG
TYNx12T
TO-220AB
2.3 g
50
Tube
Note: x = voltage
Table 9: Revision History
Date
Revision
Description of Changes
Sep-2000
3
Last update.
25-Mar-2005
4
TO-220AB delivery mode changed from bulk to tube.
14-Oct-2005
5
Changed sensitivity values in Table 7 for TYNx12 (30 to
15 mA) and TYNx12T ( 15 to 5 mA). Added ECOPACK
statement
TN12, TS12 and TYNx12 Series
11/11
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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