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Электронный компонент: TSS463VAN

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Qualpack TSS463 / TSS461C
Rev. 2 January 1999
1
TSS463 VAN
Van Controller Serial Interface
TSS461C VAN
Van Controller
TSS463/TSS461C
VAN Controllers
1999 January
TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY
Qualpack TS80C31X2/C32X2
2
Rev. 2 January 1999
1. Contents
1. Contents........................................................................................................................................................ 2
2. General Information ..................................................................................................................................... 3
3. Technology Information .............................................................................................................................. 4
3.1 W
AFER
P
ROCESS
T
ECHNOLOGY
..................................................................................................................... 4
3.2 P
RODUCT
D
ESIGN
.......................................................................................................................................... 5
3.3 P
ACKAGE
T
ECHNOLOGY
................................................................................................................................. 6
3.3.1 SOIC.300 16 leads............................................................................................................................... 6
3.3.2 Other available packages .................................................................................................................... 7
3.4 T
EST
............................................................................................................................................................. 7
3.5 D
EVICE
C
ROSS
S
ECTION
................................................................................................................................ 8
3.6 W
AFER
P
ROCESS
C
ONTROL
........................................................................................................................... 9
4. Qualification ............................................................................................................................................... 10
4.1 C
HANGE
P
ROCEDURE
................................................................................................................................... 11
4.2 Q
UALIFICATION
F
LOW
................................................................................................................................... 12
4.3 W
AFER
P
ROCESS
Q
UALIFICATION
................................................................................................................. 13
4.4 P
ACKAGE
Q
UALIFICATION
............................................................................................................................. 14
4.5 D
EVICE
Q
UALIFICATION
................................................................................................................................ 16
4.5.1 ESD and Latch-up results .................................................................................................................. 17
4.5.2 Failure Mechanisms and Corrective Actions ..................................................................................... 17
4.5.3 Qualification status............................................................................................................................. 17
4.6 O
UTGOING
Q
UALITY AND
R
ELIABILITY
............................................................................................................ 18
4.6.1 AOQ (Average Outgoing Quality) ...................................................................................................... 18
4.6.2 EFR (Early Failure Rate).................................................................................................................... 19
4.6.3 LFR (Latent Failure Rate) .................................................................................................................. 19
5. User Information ........................................................................................................................................ 20
5.1 S
OLDERING
R
ECOMMENDATIONS
.................................................................................................................. 20
5.2 DRY PACK O
RDERING RULES
..................................................................................................................... 20
5.3 ESD
CAUTION
.............................................................................................................................................. 20
6. Environmental Information ....................................................................................................................... 21
7. Other Data................................................................................................................................................... 22
7.1 ISO9001 A
PPROVAL
C
ERTIFICATE
................................................................................................................ 22
7.2 D
ATABOOK
R
EFERENCE
................................................................................................................................ 23
7.3 A
DDRESS
R
EFERENCE
.................................................................................................................................. 23
8. Revision History......................................................................................................................................... 24
Qualpack TSS463 / TSS461C
Rev. 2 January 1999
3
2. General Information
Product Name:
TSS463 / TSS461C
Function:
Van Controllers
Specific features:
Serial Interface (TSS463)
Wafer process:
Z86E
Available plastic package types:
SOIC16 (TSS463), SOIC24 (TSS461C)
Locations:
Process, product development
TEMIC Semiconductors Nantes, France
Wafer plant
TEMIC Semiconductors Nantes, France
QC responsability
TEMIC Semiconductors Nantes, France
Assembly
ANAM, Korea, Philippines
Probe test
TEMIC Semiconductors Nantes, France
Final test
GATEWAY Philippines
ANAM Korea
Quality Assurance
TEMIC Semiconductors Nantes, France
Reliability testing
TEMIC Semiconductors Nantes, France
Failure analysis
TEMIC Semiconductors Nantes, France
Quality Assurance Management Nantes
Signed..........................................................
Qualpack TS80C31X2/C32X2
4
Rev. 2 January 1999
3. Technology Information
3.1 Wafer Process Technology
Process type (Name):
CMOS (SCMOS1/2 - Z86E)
Base material:
Silicon Epi substrate type
Wafer Thickness (final)
475um
Wafer diameter
150mm
Number of masks
13
Gate oxide
Material
Silicon dioxide
Thickness
195 A
Polysilicon
Number of layers
1
Thickness
3000 A
Metal
Number of layers
2
Layer 1 material
TiN/W
Layer 1 thickness
600 + 5000 A
Layer 2 material
Ti/AlCu
Layer 2 thickness
7000 A
Passivation
Material
Si
3
N
4
on SiO2
Thickness
10000 A
Qualpack TSS463 / TSS461C
Rev. 2 January 1999
5
3.2 Product Design
Die size (TSS463)
11.15mm2 (3610m*3280m)
Die size (TSS461C)
8.46mm2 (3480m*2610m)
Logic Effective channel length
0.8m
Gate poly width
0.8m
Gate poly spacing
1.2m
Metal 1 width
1.3um
Metal 1 spacing
1.5um
Metal 2 width
1.6um
Metal 2 spacing
1.6um
Contact size
1.0m
Via size
1.4m