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Data sheet acquired from Harris Semiconductor
SCHS020C - Revised October 2003
The CD4009UB and CD4010B types are
supplied in 16-lead hermetic dual-in-line
ceramic packages (F3A suffix), 16-lead
dual-in-line plastic packages (E suffix), 16-lead
small-outline packages (M, M96, MT, and NSR
suffixes), and 16-lead thin shink small-outline
packages (PW and PWR suffixes).
Copyright
2003, Texas Instruments Incorporated
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
89264UKB3T
OBSOLETE
CFP
WR
16
None
Call TI
Call TI
CD4009UBE
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD4009UBF
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD4009UBF3A
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD4009UBM
ACTIVE
SOIC
D
16
40
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4009UBM96
ACTIVE
SOIC
D
16
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4009UBMT
ACTIVE
SOIC
D
16
250
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4009UBNSR
ACTIVE
SO
NS
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4009UBPW
ACTIVE
TSSOP
PW
16
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD4009UBPWR
ACTIVE
TSSOP
PW
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD4010BE
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD4010BF
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD4010BF3A
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD4010BM
ACTIVE
SOIC
D
16
40
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4010BM96
ACTIVE
SOIC
D
16
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4010BMT
ACTIVE
SOIC
D
16
250
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4010BNSR
ACTIVE
SO
NS
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4010BPW
ACTIVE
TSSOP
PW
16
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD4010BPWR
ACTIVE
TSSOP
PW
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
http://www.ti.com/productcontent
for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1