ChipFind - документация

Электронный компонент: CD40109BE

Скачать:  PDF   ZIP
Data sheet acquired from Harris Semiconductor
SCHS099B Revised January 2003
The CD40109, unlike other low-to-high
level-shifting circuits, does not require the
presence of the high-voltage supply (V
DD
)
before the application of either the
low-voltage supply (V
CC
) or the input
signals. There are no restrictions on the
sequence of application of V
DD
, V
CC
, or the
input signals. In addition, with one
exception there are no restrictions on the
relative magnitudes of the supply voltages
or input signals within the device maximum
ratings, provided that the input signal
swings between V
SS
and at least 0.7 V
CC
;
V
CC
may exceed V
DD
, and input signals may
exceed V
CC
and V
DD
. When operated in the
mode V
CC
> V
DD
, the CD40109 will operate
as a high-to-low level-shifter.
The CD40109B-Series types are supplied in
16-lead ceramic dual-in-line packages
(F3A suffix), 16-lead dual-in-line plastic
packages (E suffix), 16-lead small-outline
packages (NSR suffix), and 16-lead thin shrink
small-outline packages (PW and PWR suffixes).
OUTPUT VOLTAGE RANGE, ALL OUTPUTS
0.5 V to VDD +0.5 V
. . . . . . . . . . . . . . . . . .
Copyright
2003, Texas Instruments Incorporated
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
CD40109BE
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD40109BF
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD40109BF3A
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD40109BNSR
ACTIVE
SO
NS
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD40109BPW
ACTIVE
TSSOP
PW
16
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD40109BPWR
ACTIVE
TSSOP
PW
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
http://www.ti.com/productcontent
for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
10-Mar-2005
Addendum-Page 1