1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Copyright
2003 Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Data sheet acquired from Harris Semiconductor
SCHS115D Revised September 2003
V
OH
The CD4093B types are supplied in 14-lead
hermetic dual-in-line ceramic packages (F3A
suffix), 14-lead dual-in-line plastic packages (E
suffix), 14-lead small-outline packages (M, MT,
M96, and NSR suffixes), and 14-lead thin shrink
small-outline packages (PW and PWR suffixes).
PACKAGE THERMAL IMPEDANCE,
JA
(See Note 1):
E package
80
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
M package
86
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package
76
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NOTE 1:
Package thermal impedance is calculated in accordance with JESD 51-7.
V
DD
V
DD
V
P
V
N
V
SS
V
OL
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
7704602CA
ACTIVE
CDIP
J
14
1
TBD
Call TI
Level-NC-NC-NC
CD4093BE
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD4093BEE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD4093BF
ACTIVE
CDIP
J
14
1
TBD
Call TI
Level-NC-NC-NC
CD4093BF3A
ACTIVE
CDIP
J
14
1
TBD
Call TI
Level-NC-NC-NC
CD4093BM
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4093BM96
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4093BM96E4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4093BM96G4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4093BME4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4093BMT
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4093BMTE4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4093BNSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4093BNSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4093BPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4093BPWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4093BPWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4093BPWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Addendum-Page 1
PDF 
ZIP
