Data sheet acquired from Harris Semiconductor
SCHS070B Revised June 2003
The CD4508B types are supplied in 24-lead
hermetic dual-in-line ceramic packages (F3A
suffix), 24-lead dual-in-line plastic packages (E
suffix), 24-lead small-outline packages (M, M96,
and NSR suffixes), and 24-lead thin shrink
small-outline packages (PW and PWR suffixes).
The CD4508B is similar to industry type
MC14508.
Copyright
2003, Texas Instruments Incorporated
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
CD4508BD3
ACTIVE
CDIP SB
JD
24
1
None
Call TI
Level-NC-NC-NC
CD4508BE
ACTIVE
PDIP
N
24
15
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD4508BF3A
ACTIVE
CDIP
J
24
1
None
Call TI
Level-NC-NC-NC
CD4508BM
ACTIVE
SOIC
DW
24
25
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD4508BM96
ACTIVE
SOIC
DW
24
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
CD4508BNSR
ACTIVE
SO
NS
24
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4508BPW
ACTIVE
TSSOP
PW
24
60
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD4508BPWR
ACTIVE
TSSOP
PW
24
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
http://www.ti.com/productcontent
for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1
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