1
Data sheet acquired from Harris Semiconductor
SCHS143C
Features
Three-State Outputs
Separate Output Enable Inputs
Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Wide Operating Temperature Range . . . -55
o
C to 125
o
C
Balanced Propagation Delay and Transition Times
Significant Power Reduction Compared to LSTTL
Logic ICs
HC Types
- 2V to 6V Operation
- High Noise Immunity: N
IL
= 30%, N
IH
= 30% of V
CC
at V
CC
= 5V
HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
IL
= 0.8V (Max), V
IH
= 2V (Min)
- CMOS Input Compatibility, I
l
1
A at V
OL
, V
OH
Description
The 'HC125 and 'HCT125 contain 4 independent three-state
buffers, each having its own output enable input, which when
"HIGH" puts the output in the high impedance state.
Pinout
CD54HC125, CD54HCT125
(CERDIP)
CD74HC125, CD74HCT125
(PDIP, SOIC)
TOP VIEW
Ordering Information
PART NUMBER
TEMP. RANGE
(
o
C)
PACKAGE
CD54HC125F3A
-55 to 125
14 Ld CERDIP
CD54HCT125F3A
-55 to 125
14 Ld CERDIP
CD74HC125E
-55 to 125
14 Ld PDIP
CD74HC125M
-55 to 125
14 Ld SOIC
CD74HC125MT
-55 to 125
14 Ld SOIC
CD74HC125M96
-55 to 125
14 Ld SOIC
CD74HCT125E
-55 to 125
14 Ld PDIP
CD74HCT125M
-55 to 125
14 Ld SOIC
CD74HCT125MT
-55 to 125
14 Ld SOIC
CD74HCT125M96
-55 to 125
14 Ld SOIC
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel of
250.
1OE
1A
1Y
2OE
2A
2Y
GND
V
CC
4OE
4A
4Y
3OE
3A
3Y
1
2
3
4
5
6
7
14
13
12
11
10
9
8
November 1997 - Revised August 2003
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
2003, Texas Instruments Incorporated
CD54HC125, CD74HC125,
CD54HCT125, CD74HCT125
High-Speed CMOS Logic
Quad Buffer, Three-State
[ /Title
(CD74
HC125
,
CD74
HCT12
5)
/Sub-
ject
(High
Speed
CMOS
Logic
Quad
Buffer,
Three-
State)
2
Functional Diagram
Logic Diagram
TRUTH TABLE
INPUTS
OUTPUTS
nA
nOE
nY
H
L
H
L
L
L
X
H
Z
H= High Voltage Level
L= Low Voltage Level
X= Don't Care
Z= High Impedance, OFF State
1A
2OE
2A
3A
4OE
4A
1
4
5
9
13
12
3
6
1Y
3Y
4Y
GND = 7
V
CC
= 14
2Y
8
11
2
10
1OE
3OE
nY
P
n
nA
nOE
CD54HC125, CD74HC125, CD54HCT125, CD74HCT125
3
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, V
CC
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For V
I
< -0.5V or V
I
> V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . . . .
20mA
DC Output Diode Current, I
OK
For V
O
< -0.5V or V
O
> V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . .
20mA
DC Drain Current, per Output, I
O
For -0.5V < V
O
< V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . . . . . . . . 3
5mA
DC Output Source or Sink Current per Output Pin, I
O
For V
O
> -0.5V or V
O
< V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . .
25mA
DC V
CC
or Ground Current, I
CC
. . . . . . . . . . . . . . . . . . . . . . . . .
70mA
Operating Conditions
Temperature Range (T
A
) . . . . . . . . . . . . . . . . . . . . . -55
o
C to 125
o
C
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, V
I
, V
O
. . . . . . . . . . . . . . . . . 0V to V
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Thermal Resistance (Typical, Note 1)
JA
(
o
C/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .
80
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .
86
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . .-65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300
o
C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C
-55
o
C TO 125
o
C
UNITS
V
I
(V)
I
O
(mA)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
HC TYPES
High Level Input
Voltage
V
IH
-
-
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
Low Level Input
Voltage
V
IL
-
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
High Level Output
Voltage
CMOS Loads
V
OH
V
IH
or
V
IL
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
High Level Output
Voltage
TTL Loads
-6
4.5
3.98
-
-
3.84
-
3.7
-
V
-7.8
6
5.48
-
-
5.34
-
5.2
-
V
Low Level Output
Voltage
CMOS Loads
V
OL
V
IH
or
V
IL
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
Low Level Output
Voltage
TTL Loads
6
4.5
-
-
0.26
-
0.33
-
0.4
V
7.8
6
-
-
0.26
-
0.33
-
0.4
V
Input Leakage
Current
I
I
V
CC
or
GND
-
6
-
-
0.1
-
1
-
1
A
CD54HC125, CD74HC125, CD54HCT125, CD74HCT125
4
Quiescent Device
Current
I
CC
V
CC
or
GND
0
6
-
-
8
-
80
-
160
A
Three-State Leakage
Current
I
OZ
V
IL
or
V
IH
-
6
-
-
0.5
-
5
-
10
A
HCT TYPES
High Level Input
Voltage
V
IH
-
-
4.5 to
5.5
2
-
-
2
-
2
-
V
Low Level Input
Voltage
V
IL
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
High Level Output
Voltage
CMOS Loads
V
OH
V
IH
or
V
IL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
High Level Output
Voltage
TTL Loads
-6
4.5
3.98
-
-
3.84
-
3.7
-
V
Low Level Output
Voltage
CMOS Loads
V
OL
V
IH
or
V
IL
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
Low Level Output
Voltage
TTL Loads
6
4.5
-
-
0.26
-
0.33
-
0.4
V
Input Leakage
Current
I
I
V
CC
to
GND
0
5.5
-
-
0.1
-
1
-
1
A
Quiescent Device
Current
I
CC
V
CC
or
GND
0
5.5
-
-
8
-
80
-
160
A
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
I
CC
(Note 2)
V
CC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
A
Three-State Leakage
Current
I
OZ
V
IL
or
V
IH
-
5.5
-
-
0.5
-
5
-
10
A
NOTE:
2. For dual-supply systems theoretical worst case (V
I
= 2.4V, V
CC
= 5.5V) specification is 1.8mA.
DC Electrical Specifications
(Continued)
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C
-55
o
C TO 125
o
C
UNITS
V
I
(V)
I
O
(mA)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
HCT Input Loading Table
INPUT
UNIT LOADS
nA, nOE
1
NOTE: Unit Load is
I
CC
limit specified in DC Electrical
Specifications table, e.g., 360
A max at 25
o
C.
CD54HC125, CD74HC125, CD54HCT125, CD74HCT125
5
Switching Specifications
Input t
r
, t
f
= 6ns
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C
-55
o
C TO 125
o
C
UNITS
TYP
MAX
MAX
MAX
HC TYPES
Propagation Delay Time
nA to nY
t
PLH
, t
PHL
C
L
= 50pF
2
-
100
125
150
ns
4.5
-
20
25
30
ns
C
L
= 15pF
5
8
-
-
-
ns
CL = 50pF
6
-
17
21
26
ns
Enable Delay Time
t
PZL,
t
PZH
C
L
= 50pF
2
-
125
155
190
ns
4.5
-
25
31
38
ns
C
L
= 15pF
5
10
-
-
-
ns
CL = 50pF
6
-
21
26
32
ns
Disable Delay Time
t
PLZ
, t
PHZ
CL = 50pF
2
-
125
155
190
ns
C
L
= 50pF
4.5
-
25
31
38
ns
C
L
= 15pF
5
10
-
-
-
ns
CL = 50pF
6
-
21
26
32
ns
Output Transition Time
t
TLH
, t
THL
C
L
= 50pF
2
-
60
75
90
ns
4.5
-
12
15
18
ns
6
-
10
13
15
ns
Input Capacitance
C
I
-
-
-
10
10
10
pF
Three-State Output
Capacitance
C
O
-
-
-
20
20
20
pF
Power Dissipation
Capacitance
(Notes 3, 4)
C
PD
-
5
29
-
-
-
pF
HCT TYPES
Propagation Delay Time
nA to nY
t
PLH
, t
PHL
C
L
= 50pF
4.5
-
25
31
38
ns
C
L
= 15pF
5
10
-
-
-
ns
Output Enable Time
t
PZL,
t
PZH
C
L
= 50pF
4.5
-
25
31
38
ns
C
L
= 15pF
5
10
-
-
-
ns
Output Disabling Time
t
PLZ
, t
PHZ
C
L
= 50pF
4.5
-
28
35
42
ns
C
L
= 15pF
5
11
-
-
-
ns
Output Transition Times
t
TLH
, t
THL
C
L
= 50pF
4.5
-
12
15
18
ns
Input Capacitance
C
I
-
-
-
10
10
10
pF
Three-State Output
Capacitance
C
O
-
-
-
20
20
20
pF
Power Dissipation
Capacitance
(Notes 3, 4)
C
PD
-
5
34
-
-
-
pF
NOTES:
3. C
PD
is used to determine the dynamic power consumption, per channel.
4. P
D
= V
CC
2
f
i
(C
PD
+ C
L
) where f
i
= Input Frequency, f
O
= Output Frequency, C
L
= Output Load Capacitance, V
CC
= Supply Voltage.
CD54HC125, CD74HC125, CD54HCT125, CD74HCT125
6
Test Circuits and Waveforms
FIGURE 1. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
FIGURE 3. HC THREE-STATE PROPAGATION DELAY
WAVEFORM
FIGURE 4. HCT THREE-STATE PROPAGATION DELAY
WAVEFORM
NOTE:
Open drain waveforms t
PLZ
and t
PZL
are the same as those for three-state shown on the left. The test circuit is Output R
L
= 1k
to
V
CC
, C
L
= 50pF.
FIGURE 5. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
t
PHL
t
PLH
t
THL
t
TLH
90%
50%
10%
50%
10%
INVERTING
OUTPUT
INPUT
GND
V
CC
t
r
= 6ns
t
f
= 6ns
90%
t
PHL
t
PLH
t
THL
t
TLH
2.7V
1.3V
0.3V
1.3V
10%
INVERTING
OUTPUT
INPUT
GND
3V
t
r
= 6ns
t
f
= 6ns
90%
50%
10%
90%
GND
V
CC
10%
90%
50%
50%
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
OUTPUTS
ENABLED
OUTPUTS
DISABLED
OUTPUTS
ENABLED
6ns
6ns
t
PZH
t
PHZ
t
PZL
t
PLZ
0.3
2.7
GND
3V
10%
90%
1.3V
1.3V
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
OUTPUTS
ENABLED
OUTPUTS
DISABLED
OUTPUTS
ENABLED
t
r
6ns
t
PZH
t
PHZ
t
PZL
t
PLZ
6ns
t
f
1.3
IC WITH
THREE-
STATE
OUTPUT
OTHER
INPUTS
TIED HIGH
OR LOW
OUTPUT
DISABLE
V
CC
FOR t
PLZ
AND t
PZL
GND FOR t
PHZ
AND t
PZH
OUTPUT
R
L
= 1k
C
L
50pF
CD54HC125, CD74HC125, CD54HCT125, CD74HCT125
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
CD54HC125F
ACTIVE
CDIP
J
14
1
TBD
Call TI
Level-NC-NC-NC
CD54HC125F3A
ACTIVE
CDIP
J
14
1
TBD
Call TI
Level-NC-NC-NC
CD54HCT125F3A
ACTIVE
CDIP
J
14
1
TBD
Call TI
Level-NC-NC-NC
CD74HC125E
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD74HC125M
ACTIVE
SOIC
D
14
50
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD74HC125M96
ACTIVE
SOIC
D
14
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD74HC125MT
ACTIVE
SOIC
D
14
250
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT125E
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD74HCT125M
ACTIVE
SOIC
D
14
50
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT125M96
ACTIVE
SOIC
D
14
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD74HCT125MT
ACTIVE
SOIC
D
14
250
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
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PACKAGE OPTION ADDENDUM
www.ti.com
5-May-2005
Addendum-Page 1
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is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright
2005, Texas Instruments Incorporated
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