ChipFind - документация

Электронный компонент: SN74HC04D

Скачать:  PDF   ZIP
SN54HC04, SN74HC04
HEX INVERTERS
SCLS078D DECEMBER 1982 REVISED JULY 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D
Wide Operating Voltage Range of 2 V to 6 V
D
Outputs Can Drive Up To 10 LSTTL Loads
D
Low Power Consumption, 20-
A Max I
CC
D
Typical t
pd
= 8 ns
D
4-mA Output Drive at 5 V
D
Low Input Current of 1
A Max
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1Y
2A
2Y
3A
3Y
GND
V
CC
6A
6Y
5A
5Y
4A
4Y
SN54HC04 . . . J OR W PACKAGE
SN74HC04 . . . D, N, NS, OR PW PACKAGE
(TOP VIEW)
3
2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
6Y
NC
5A
NC
5Y
2A
NC
2Y
NC
3A
1Y
1A
NC
4Y
4A
V
6A
3Y
GND
NC
SN54HC04 . . . FK PACKAGE
(TOP VIEW)
CC
NC No internal connection
description/ordering information
The 'HC04 devices contain six independent inverters. They perform the Boolean function
Y = A in positive logic.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP N
Tube of25
SN74HC04N
SN74HC04N
Tube of 50
SN74HC04D
SOIC D
Reel of 2500
SN74HC04DR
HC04
40
C to 85
C
Reel of 250
SN74HC04DT
40
C to 85
C
SOP NS
Reel of 2000
SN74HC04NSR
HC04
Tube of 90
SN74HC04PW
TSSOP PW
Reel of 2000
SN74HC04PWR
HC04
Reel of 250
SN74HC04PWT
CDIP J
Tube of 25
SNJ54HC04J
SNJ54HC04J
55
C to 125
C
CFP W
Tube of 150
SNJ54HC04W
SNJ54HC04W
LCCC FK
Tube of 55
SNJ54HC04FK
SNJ54HC04FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each inverter)
INPUT
A
OUTPUT
Y
H
L
L
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54HC04, SN74HC04
HEX INVERTERS
SCLS078D DECEMBER 1982 REVISED JULY 2003
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
logic diagram (positive logic)
A
Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I
IK
(V
I
< 0 or V
I
> V
CC
) (see Note 1)
20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, I
OK
(V
O
< 0 or V
O
> V
CC
) (see Note 1)
20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, I
O
(V
O
= 0 to V
CC
)
25 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through V
CC
or GND
50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
JA
(see Note 2): D package
86
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package
80
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package
76
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package
113
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
65
C to 150
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC04
SN74HC04
UNIT
MIN
NOM
MAX
MIN
NOM
MAX
UNIT
VCC
Supply voltage
2
5
6
2
5
6
V
VCC = 2 V
1.5
1.5
VIH
High-level input voltage
VCC = 4.5 V
3.15
3.15
V
VCC = 6 V
4.2
4.2
VCC = 2 V
0.5
0.5
VIL
Low-level input voltage
VCC = 4.5 V
1.35
1.35
V
VCC = 6 V
1.8
1.8
VI
Input voltage
0
VCC
0
VCC
V
VO
Output voltage
0
VCC
0
VCC
V
VCC = 2 V
1000
1000
t/
v
Input transition rise/fall time
VCC = 4.5 V
500
500
ns
VCC = 6 V
400
400
TA
Operating free-air temperature
55
125
40
85
C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN54HC04, SN74HC04
HEX INVERTERS
SCLS078D DECEMBER 1982 REVISED JULY 2003
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25
C
SN54HC04
SN74HC04
UNIT
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNIT
2 V
1.9
1.998
1.9
1.9
IOH = 20
A
4.5 V
4.4
4.499
4.4
4.4
VOH
VI = VIH or VIL
6 V
5.9
5.999
5.9
5.9
V
IOH = 4 mA
4.5 V
3.98
4.3
3.7
3.84
IOH = 5.2 mA
6 V
5.48
5.8
5.2
5.34
2 V
0.002
0.1
0.1
0.1
IOL = 20
A
4.5 V
0.001
0.1
0.1
0.1
VOL
VI = VIH or VIL
6 V
0.001
0.1
0.1
0.1
V
IOL = 4 mA
4.5 V
0.17
0.26
0.4
0.33
IOL = 5.2 mA
6 V
0.15
0.26
0.4
0.33
II
VI = VCC or 0
6 V
0.1
100
1000
1000
nA
ICC
VI = VCC or 0,
IO = 0
6 V
2
40
20
A
Ci
2 V to 6 V
3
10
10
10
pF
switching characteristics over recommended operating free-air temperature range, C
L
= 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25
C
SN54HC04
SN74HC04
UNIT
PARAMETER
(INPUT)
(OUTPUT)
VCC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNIT
2 V
45
95
145
120
tpd
A
Y
4.5 V
9
19
29
24
ns
6 V
8
16
25
20
2 V
38
75
110
95
tt
Y
4.5 V
8
15
22
19
ns
6 V
6
13
19
16
operating characteristics, T
A
= 25
C
PARAMETER
TEST CONDITIONS
TYP
UNIT
Cpd
Power dissipation capacitance per inverter
No load
20
pF
SN54HC04, SN74HC04
HEX INVERTERS
SCLS078D DECEMBER 1982 REVISED JULY 2003
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
50%
50%
10%
10%
90%
90%
VCC
0 V
tr
tf
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%
50%
10%
10%
90%
90%
VCC
VOH
VOL
0 V
tr
tf
Input
In-Phase
Output
50%
tPLH
tPHL
50%
50%
10%
10%
90%
90%
VOH
VOL
tr
tf
tPHL
tPLH
Out-of-Phase
Output
Test
Point
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR
1 MHz, ZO = 50
, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-8409801VCA
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
5962-8409801VDA
ACTIVE
CFP
W
14
1
None
Call TI
Level-NC-NC-NC
84098012A
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
8409801CA
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
8409801DA
ACTIVE
CFP
W
14
1
None
Call TI
Level-NC-NC-NC
JM38510/65701B2A
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
JM38510/65701BCA
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
JM38510/65701BDA
ACTIVE
CFP
W
14
1
None
Call TI
Level-NC-NC-NC
SN54HC04J
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
SN74HC04D
ACTIVE
SOIC
D
14
50
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74HC04DBR
ACTIVE
SSOP
DB
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74HC04DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74HC04DT
ACTIVE
SOIC
D
14
250
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74HC04N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74HC04N3
OBSOLETE
PDIP
N
14
None
Call TI
Call TI
SN74HC04NSR
ACTIVE
SO
NS
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74HC04PW
ACTIVE
TSSOP
PW
14
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74HC04PWLE
OBSOLETE
TSSOP
PW
14
None
Call TI
Call TI
SN74HC04PWR
ACTIVE
TSSOP
PW
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74HC04PWT
ACTIVE
TSSOP
PW
14
250
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SNJ54HC04FK
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
SNJ54HC04J
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
SNJ54HC04W
ACTIVE
CFP
W
14
1
None
Call TI
Level-NC-NC-NC
SNV54HC04J
ACTIVE
CDIP
J
14
None
Call TI
Call TI
SNV54HC04W
ACTIVE
CFP
W
14
None
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
http://www.ti.com/productcontent
for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
www.ti.com
8-Mar-2005
Addendum-Page 1
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
8-Mar-2005
Addendum-Page 2
MECHANICAL DATA

MLCC006B OCTOBER 1996
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
4040140 / D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MIN
MAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)
(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
13
14
15
16
18
17
11
10
8
9
7
5
4
3
2
0.020 (0,51)
0.010 (0,25)
6
1
28
26
27
19
21
B SQ
A SQ
22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,90
7,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
20
16
6,50
6,50
14
0,05 MIN
5,90
5,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65
M
0,15
0
8
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
MECHANICAL DATA

MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
20
16
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
8
0,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM
PINS **
0,05
4,90
5,10
Seating Plane
0
8
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI's terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright
2005, Texas Instruments Incorporated