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FEATURES
3
2
4
5
1
NC
V
CC
Y
A
GND
DBV PACKAGE
(TOP VIEW)
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
DCK PACKAGE
(TOP VIEW)
3
2
4
5
1
NC
V
CC
Y
A
GND
3
2
4
5
1
NC
Y
A
GND
DNU
GND
V
CC
Y
A
DRL PACKAGE
(TOP VIEW)
See mechanical drawings for dimensions.
1
4
2
3
5
V
CC
DNU - Do not use
YZV PACKAGE
(BOTTOM VIEW)
GND
V
CC
Y
A
3
1
2
4
DESCRIPTION/ORDERING INFORMATION
SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES296T FEBRUARY 2000 REVISED OCTOBER 2005
Available in the Texas Instruments
I
off
Supports Partial-Power-Down Mode
NanoStarTM and NanoFreeTM Packages
Operation
Supports 5-V V
CC
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Input and Open-Drain Output Accept
Voltages up to 5.5 V
ESD Protection Exceeds JESD 22
Max t
pd
of 4.2 ns at 3.3 V
2000-V Human-Body Model (A114-A)
Low Power Consumption, 10-
A Max I
CC
200-V Machine Model (A115-A)
24-mA Output Drive at 3.3 V
1000-V Charged-Device Model (C101)
This single buffer/driver is designed for 1.65-V to 5.5-V V
CC
operation.
NanoStarTM and NanoFreeTM package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
The output of the SN74LVC1G07 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using I
off
.The I
off
circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright 20002005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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A
Y
2
4
A
Y
1
3
SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES296T FEBRUARY 2000 REVISED OCTOBER 2005
ORDERING INFORMATION
ORDERABLE
TOP-SIDE
T
A
PACKAGE
(1)
PART NUMBER
MARKING
(2)
NanoStarTM WCSP (DSBGA)
SN74LVC1G07YEAR
0.17-mm Small Bump YEA
NanoFreeTM WCSP (DSBGA)
SN74LVC1G07YZAR
0.17-mm Small Bump YZA (Pb-free)
Reel of 3000
_ _ _CV_
NanoStarTM WCSP (DSBGA)
SN74LVC1G07YEPR
0.23-mm Large Bump YEP
NanoFreeTM WCSP (DSBGA)
SN74LVC1G07YZPR
0.23-mm Large Bump YZP (Pb-free)
40C to 85C
NanoFreeTM WCSP (DSBGA)
_ _ _ _
Reel of 3000
SN74LVC1G07YZVR
0.23-mm Large Bump YZV (Pb-free)
CV
Reel of 3000
SN74LVC1G07DBVR
SOT (SOT-23) DBV
C07_
Reel of 250
SN74LVC1G07DBVT
Reel of 3000
SN74LVC1G07DCKR
SOT (SC-70) DCK
CV_
Reel of 250
SN74LVC1G07DCKT
SOT (SOT-553) DRL
Reel of 4000
SN74LVC1G07DRLR
CV_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YEP, YZA/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2
has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
FUNCTION TABLE
INPUT
OUTPUT
A
Y
H
H
L
L
LOGIC DIAGRAM (POSITIVE LOGIC)
(DBV, DCK, DRL, YEA, YEP, YZA, and YZP Package)
LOGIC DIAGRAM (POSITIVE LOGIC)
(YZV Package)
2
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Absolute Maximum Ratings
(1)
SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES296T FEBRUARY 2000 REVISED OCTOBER 2005
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V
CC
Supply voltage range
0.5
6.5
V
V
I
Input voltage range
(2)
0.5
6.5
V
V
O
Voltage range applied to any output in the high-impedance or power-off state
(2)
0.5
6.5
V
V
O
Voltage range applied to any output in the high or low state
(2) (3)
0.5
6.5
V
I
IK
Input clamp current
V
I
< 0
50
mA
I
OK
Output clamp current
V
O
< 0
50
mA
I
O
Continuous output current
50
mA
Continuous current through V
CC
or GND
100
mA
DBV package
206
DCK package
252
DRL package
142
JA
Package thermal impedance
(4)
C/W
YEA/YZA package
154
YEP/YZP package
132
YZV package
116
T
stg
Storage temperature range
65
150
C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3)
The value of V
CC
is provided in the recommended operating conditions table.
(4)
The package thermal impedance is calculated in accordance with JESD 51-7.
3
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Recommended Operating Conditions
(1)
Electrical Characteristics
Switching Characteristics
SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES296T FEBRUARY 2000 REVISED OCTOBER 2005
MIN
MAX
UNIT
Operating
1.65
5.5
V
CC
Supply voltage
V
Data retention only
1.5
V
CC
= 1.65 V to 1.95 V
0.65
V
CC
V
CC
= 2.3 V to 2.7 V
1.7
V
IH
High-level input voltage
V
V
CC
= 3 V to 3.6 V
2
V
CC
= 4.5 V to 5.5 V
0.7
V
CC
V
CC
= 1.65 V to 1.95 V
0.35
V
CC
V
CC
= 2.3 V to 2.7 V
0.7
V
IL
Low-level input voltage
V
V
CC
= 3 V to 3.6 V
0.8
V
CC
= 4.5 V to 5.5 V
0.3
V
CC
V
I
Input voltage
0
5.5
V
V
O
Output voltage
0
5.5
V
V
CC
= 1.65 V
4
V
CC
= 2.3 V
8
I
OL
Low-level output current
16
mA
V
CC
= 3 V
24
V
CC
= 4.5 V
32
V
CC
= 1.8 V
0.15 V, 2.5 V
0.2 V
20
t/
v
Input transition rise or fall rate
V
CC
= 3.3 V
0.3 V
10
ns/V
V
CC
= 5 V
0.5 V
5
T
A
Operating free-air temperature
40
85
C
(1)
All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V
CC
MIN TYP
(1)
MAX
UNIT
I
OL
= 100
A
1.65 V to 5.5 V
0.1
I
OL
= 4 mA
1.65 V
0.45
I
OL
= 8 mA
2.3 V
0.3
V
OL
V
I
OL
= 16 mA
0.4
3 V
I
OL
= 24 mA
0.55
I
OL
= 32 mA
4.5 V
0.55
I
I
A input
V
I
= 5.5 V or GND
0 to 5.5 V
5
A
I
off
V
I
or V
O
= 5.5 V
0
10
A
I
CC
V
I
= 5.5 V or GND,
I
O
= 0
1.65 V to 5.5 V
10
A
I
CC
One input at V
CC
0.6 V,
Other inputs at V
CC
or GND
3 V to 5.5 V
500
A
C
i
V
I
= V
CC
or GND
3.3 V
4
pF
C
o
V
O
= V
CC
or GND
3.3 V
5
pF
(1)
All typical values are at V
CC
= 3.3 V, T
A
= 25
C.
over recommended operating free-air temperature range (unless otherwise noted) (see
Figure 1
)
V
CC
= 1.8 V
V
CC
= 2.5 V
V
CC
= 3.3 V
V
CC
= 5 V
FROM
TO
0.15 V
0.2 V
0.3 V
0.5 V
PARAMETER
UNIT
(INPUT)
(OUTPUT)
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
t
pd
A
Y
2.4
8.3
1
5.5
1.5
4.2
1
3.5
ns
4
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Operating Characteristics
SN74LVC1G07
SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES296T FEBRUARY 2000 REVISED OCTOBER 2005
T
A
= 25
C
V
CC
= 1.8 V
V
CC
= 2.5 V
V
CC
= 3.3 V
V
CC
= 5 V
PARAMETER
TEST CONDITIONS
UNIT
TYP
TYP
TYP
TYP
C
pd
Power dissipation capacitance
f = 10 MHz
3
3
4
6
pF
5
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