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Электронный компонент: THS4500IDGN

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THS4500
THS4501
SLOS350D - APRIL 2002 - REVISED JANUARY 2004
WIDEBAND, LOW DISTORTION FULLY DIFFERENTIAL AMPLIFIERS
DGK-8
DGN-8
D-8
FEATURES
D
Fully Differential Architecture
D
Bandwidth: 370 MHz
D
Slew Rate: 2800 V/
s
D
IMD
3
: -90 dBc at 30 MHz
D
OIP
3
: 49 dBm at 30 MHz
D
Output Common-Mode Control
D
Wide Power Supply Voltage Range: 5 V,
5 V,
12 V, 15 V
D
Input Common-Mode Range Shifted to
Include the Negative Power Supply Rail
D
Power-Down Capability (THS4500)
D
Evaluation Module Available
DESCRIPTION
The THS4500 and THS4501 are high-performance fully
differential amplifiers from Texas Instruments. The
THS4500, featuring power-down capability, and the
THS4501, without power-down capability, set new
performance standards for fully differential amplifiers
with unsurpassed linearity, supporting 14-bit operation
through 40 MHz. Package options include the 8-pin
SOIC and the 8-pin MSOP with PowerPAD
for a
smaller footprint, enhanced ac performance, and
improved thermal dissipation capability.
APPLICATIONS
D
High Linearity Analog-to-Digital Converter
Preamplifier
D
Wireless Communication Receiver Chains
D
Single-Ended to Differential Conversion
D
Differential Line Driver
D
Active Filtering of Differential Signals
1
2
3
4
8
7
6
5
VIN-
VIN+
VOCM
VS+
VOUT+
PD
VS-
VOUT-
RELATED DEVICES
DEVICE(1)
DESCRIPTION
THS4500/1
370 MHz, 2800 V/
s, VICR Includes VS-
THS4502/3
370 MHz, 2800 V/
s, Centered VICR
THS4120/1
3.3 V, 100 MHz, 43 V/
s, 3.7 nV
Hz
THS4130/1
15 V, 150 MHz, 51 V/
s, 1.3 nV
Hz
THS4140/1
15 V, 160 MHz, 450 V/
s, 6.5 nV
Hz
THS4150/1
15 V, 150 MHz, 650 V/
s, 7.6 nV
Hz
(1) Even numbered devices feature power-down capability
APPLICATION CIRCUIT DIAGRAM
f - Frequency - MHz
-80
-92
10
20
40
60
- Third-Order Intermodulation Distortion - dBc
-74
THIRD-ORDER INTERMODULATION
DISTORTION
-62
80
100
-68
-86
-98
12
10
14
16
IMD
3
Bits
V
S
392
+
-
-
+
800
V
S+
V
OUT
392
402
56.2
50
374
VOCM
2.5 V
V
S-
30
50
70
90
VS = 5 V
VS =
5 V
-
+
-
+
VOCM
12 Bit/80 MSps
IN
IN
5 V
Vref
5 V
VS
0.1
F
10
F
392
10 pF
1
F
56.2
ADC
374
50
402
392
10 pF
24.9
24.9
PowerPAD is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA
information current as of publication date. Products conform to specifications per
the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
www.ti.com
Copyright
2002-2004, Texas Instruments Incorporated
THS4500
THS4501
SLOS350D - APRIL 2002 - REVISED JANUARY 2004
www.ti.com
2
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
UNIT
Supply voltage, V
S
16.5 V
Input voltage, V
I
V
S
Output current, I
O
(2)
150 mA
Differential input voltage, V
ID
4 V
Continuous power dissipation See Dissipation Rating Table
Maximum junction temperature, T
J
(3)
150
C
Maximum junction temperature, continuous
operation, long term reliability T
J
(4)
125
C
Operating free-air temperature
C suffix
0
C to 70
C
Operating free-air temperature
range, T
A
I suffix
-40
C to 85
C
Storage temperature range, T
stg
-65
C to 150
C
Lead temperature
1,6 mm (1/16 inch) from case for 10 seconds
300
C
HBM
4000 V
ESD ratings:
CDM
2000 V
ESD ratings:
MM
100 V
(1)
Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2)
The THS4500/1 may incorporate a PowerPAD
on the underside
of the chip. This acts as a heat sink and must be connected to a
thermally dissipative plane for proper power dissipation. Failure
to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI
technical briefs SLMA002 and SLMA004 for more information
about utilizing the PowerPAD thermally enhanced package.
(3)
The absolute maximum temperature under any condition is
limited by the constraints of the silicon process.
(4)
The maximum junction temperature for continuous operation is
limited by package constraints. Operation above this temperature
may result in reduced reliability and/or lifetime of the device.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE DISSIPATION RATINGS
PACKAGE
JC
JA
(1)
POWER RATING(2)
PACKAGE
JC
(
C/W)
JA
(1)
(
C/W)
TA
25
C
TA = 85
C
D (8 pin)
38.3
97.5
1.02 W
410 mW
DGN (8 pin)
4.7
58.4
1.71 W
685 mW
DGK (8 pin)
54.2
260
385 mW
154 mW
(1) This data was taken using the JEDEC standard High-K test PCB.
(2) Power rating is determined with a junction temperature of 125
C.
This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the
junction temperature at or below 125
C for best performance and
long term reliability.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
Supply voltage
Dual supply
5
7.5
V
Supply voltage
Single supply
4.5
5
15
V
Operating free-
air temperature,
C suffix
0
70
C
air temperature,
T
A
I suffix
-40
85
C
PACKAGE/ORDERING INFORMATION
ORDERABLE PACKAGE AND NUMBER
TEMPERATURE
PLASTIC
SMALL OUTLINE
PLASTIC MSOP(1)
PowerPad
PLASTIC MSOP(1)
SMALL OUTLINE
(D)
(DGN)
SYMBOL
(DGK)
SYMBOL
0
C to 70
C
THS4500CD
THS4500CDGN
BFB
THS4500CDGK
ATV
0
C to 70
C
THS4501CD
THS4501CDGN
BFD
THS4501CDGK
ATW
-40
C to 85
C
THS4500ID
THS4500IDGN
BFC
THS4500IDGK
ASV
-40
C to 85
C
THS4501ID
THS4501IDGN
BFE
THS4501IDGK
ASW
(1) All packages are available taped and reeled. The R suffix standard quantity is 2500. The T suffix standard quantity is 250 (e.g., THS4501DT).
THS4500
THS4501
SLOS350D - APRIL 2002 - REVISED JANUARY 2004
www.ti.com
3
PIN ASSIGNMENTS
THS4501
(TOP VIEW)
V
IN-
1
2
3
4
8
7
6
5
V
OCM
V
S+
V
OUT+
V
IN+
V
S-
V
OUT-
PD
D, DGN, DGK
THS4500
(TOP VIEW)
D, DGN, DGK
V
IN-
1
2
3
4
8
7
6
5
V
OCM
V
S+
V
OUT+
V
IN+
V
S-
V
OUT-
NC
ELECTRICAL CHARACTERISTICS V
S
=
5 V
R
f
= R
g
= 392
, R
L
= 800
, G = +1, Single-ended input unless otherwise noted.
THS4500 AND THS4501
PARAMETER
TEST CONDITIONS
TYP
OVER TEMPERATURE
MIN/
PARAMETER
TEST CONDITIONS
25
C
25
C
0
C to
70
C
-40
C to
85
C
UNITS
MIN/
TYP/
MAX
AC PERFORMANCE
G = +1, PIN= -20 dBm, Rf = 392
370
MHz
Typ
Small-signal bandwidth
G = +2, PIN= -30 dBm, Rf = 1 k
175
MHz
Typ
Small-signal bandwidth
G = +5, PIN= -30 dBm, Rf = 2.4 k
70
MHz
Typ
G = +10, PIN = -30 dBm, Rf = 5.1 k
30
MHz
Typ
Gain-bandwidth product
G > +10
300
MHz
Typ
Bandwidth for 0.1dB flatness
PIN = -20 dBm
150
MHz
Typ
Large-signal bandwidth
VP = 2 V
220
MHz
Typ
Slew rate
4 VPP Step
2800
V/
s
Typ
Rise time
2 VPP Step
0.4
ns
Typ
Fall time
2 VPP Step
0.5
ns
Typ
Settling time to 0.01%
VO = 4 VPP
8.3
ns
Typ
0.1%
VO = 4 VPP
6.3
ns
Typ
Harmonic distortion
G = +1, VO = 2 VPP
Typ
2nd harmonic
f = 8 MHz
-82
dBc
Typ
2nd harmonic
f = 30 MHz
-71
dBc
Typ
3rd harmonic
f = 8 MHz
-97
dBc
Typ
3rd harmonic
f = 30 MHz
-74
dBc
Typ
Third-order intermodulation
distortion
VO = 2 VPP, fc = 30 MHz,
Rf = 392
, 200 kHz tone spacing
-90
dBc
Typ
Third-order output intercept point
fc = 30 MHz, Rf = 392
,
Referenced to 50
49
dBm
Typ
Input voltage noise
f > 1 MHz
7
nV/
Hz
Typ
Input current noise
f > 100 kHz
1.7
pA/
Hz
Typ
Overdrive recovery time
Overdrive = 5.5 V
60
ns
Typ
THS4500
THS4501
SLOS350D - APRIL 2002 - REVISED JANUARY 2004
www.ti.com
4
ELECTRICAL CHARACTERISTICS V
S
=
5 V
R
f
= R
g
= 392
, R
L
= 800
, G = +1, Single-ended input unless otherwise noted (continued).
THS4500 AND THS4501
PARAMETER
TEST CONDITIONS
TYP
OVER TEMPERATURE
MIN/
PARAMETER
TEST CONDITIONS
25
C
25
C
0
C to
70
C
-40
C to
85
C
UNITS
MIN/
TYP/
MAX
DC PERFORMANCE
Open-loop voltage gain
55
52
50
50
dB
Min
Input offset voltage
-4
-7 / -1
-8 / 0
-9 / +1
mV
Max
Average offset voltage drift
10
10
V/
C
Typ
Input bias current
4
4.6
5
5.2
A
Max
Average bias current drift
10
10
nA/
C
Typ
Input offset current
0.5
1
2
2
A
Max
Average offset current drift
40
40
nA/
C
Typ
INPUT
Common-mode input range
-5.7/2.
6
-5.4 / 2.3
-5.1 / 2
-5.1 / 2
V
Min
Common-mode rejection ratio
80
74
70
70
dB
Min
Input impedance
107 || 1
|| pF
Typ
OUTPUT
Differential output voltage swing
RL = 1 k
8
7.6
7.4
7.4
V
Min
Differential output current drive
RL = 20
120
110
100
100
mA
Min
Output balance error
PIN = -20 dBm, f = 100 kHz
-58
dB
Typ
Closed-loop output impedance
(single-ended)
f = 1 MHz
0.1
Typ
OUTPUT COMMON-MODE VOLTAGE CONTROL
Small-signal bandwidth
RL = 400
180
MHz
Typ
Slew rate
2 VPP step
92
V/
s
Typ
Minimum gain
1
0.98
0.98
0.98
V/V
Min
Maximum gain
1
1.02
1.02
1.02
V/V
Max
Common-mode offset voltage
-0.4
-4.6/+3.8
-6.6/+5.8
-7.6/+6.8
mV
Max
Input bias current
VOCM = 2.5 V
100
150
170
170
A
Max
Input voltage range
4
3.7
3.4
3.4
V
Min
Input impedance
25 || 1
k
|| pF
Typ
Maximum default voltage
VOCM left floating
0
0.05
0.10
0.10
V
Max
Minimum default voltage
VOCM left floating
0
-0.05
-0.10
-0.10
V
Min
POWER SUPPLY
Specified operating voltage
5
7.5
7.5
7.5
V
Max
Maximum quiescent current
23
28
32
34
mA
Max
Minimum quiescent current
23
18
14
12
mA
Min
Power supply rejection (
PSRR)
80
76
73
70
dB
Min
POWER DOWN (THS4500 ONLY)
Enable voltage threshold
Device enabled ON above 2.9 V
-2.9
V
Min
Disable voltage threshold
Device disabled OFF below 4.3 V
-4.3
V
Max
Power-down quiescent current
800
1000
1200
1200
A
Max
Input bias current
200
240
260
260
A
Max
Input impedance
50 || 1
k
|| pF
Typ
Turnon time delay
1000
ns
Typ
Turnoff time delay
800
ns
Typ
THS4500
THS4501
SLOS350D - APRIL 2002 - REVISED JANUARY 2004
www.ti.com
5
ELECTRICAL CHARACTERISTICS V
S
= 5 V
R
f
= R
g
= 392
, R
L
= 800
, G = +1, Single-ended input unless otherwise noted.
THS4500 AND THS4501
PARAMETER
TEST CONDITIONS
TYP
OVER TEMPERATURE
MIN/
PARAMETER
TEST CONDITIONS
25
C
25
C
0
C to
70
C
-40
C to
85
C
UNITS
MIN/
TYP/
MAX
AC PERFORMANCE
G = +1, PIN = -20 dBm, Rf = 392
320
MHz
Typ
Small-signal bandwidth
G = +2, PIN = -30 dBm, Rf = 1 k
160
MHz
Typ
Small-signal bandwidth
G = +5, PIN = -30 dBm, Rf = 2.4 k
60
MHz
Typ
G = +10, PIN = -30 dBm, Rf = 5.1 k
30
MHz
Typ
Gain-bandwidth product
G > +10
300
MHz
Typ
Bandwidth for 0.1 dB flatness
PIN = -20 dBm
180
MHz
Typ
Large-signal bandwidth
VP = 1 V
200
MHz
Typ
Slew rate
2 VPP Step
1300
V/
s
Typ
Rise time
2 VPP Step
0.5
ns
Typ
Fall time
2 VPP Step
0.6
ns
Typ
Settling time to 0.01%
VO = 2 V Step
13.1
ns
Typ
0.1%
VO = 2 V Step
8.3
ns
Typ
Harmonic distortion
G = +1, VO = 2 VPP
Typ
2nd harmonic
f = 8 MHz,
-80
dBc
Typ
2nd harmonic
f = 30 MHz
-55
dBc
Typ
3rd harmonic
f = 8 MHz
-76
dBc
Typ
3rd harmonic
f = 30 MHz
-60
dBc
Typ
Input voltage noise
f > 1 MHz
7
nV/
Hz
Typ
Input current noise
f > 100 kHz
1.7
pA/
Hz
Typ
Overdrive recovery time
Overdrive = 5.5 V
60
ns
Typ
DC PERFORMANCE
Open-loop voltage gain
54
51
49
49
dB
Min
Input offset voltage
-4
-7 / -1
-8 / 0
-9 / +1
mV
Max
Average offset voltage drift
10
10
V/
C
Typ
Input bias current
4
4.6
5
5.2
A
Max
Average bias current drift
10
10
nA/
C
Typ
Input offset current
0.5
0.7
1.2
1.2
A
Max
Average offset current drift
20
20
nA/
C
Typ
INPUT
Common-mode input range
-0.7/2.
6
-0.4 / 2.3
-0.1 / 2
-0.1 / 2
V
Min
Common-mode rejection ratio
80
74
70
70
dB
Min
Input Impedance
107 || 1
|| pF
Typ
OUTPUT
Differential output voltage swing
RL = 1 k
, Referenced to 2.5 V
3.3
3
2.8
2.8
V
Min
Output current drive
RL = 20
100
90
80
80
mA
Min
Output balance error
PIN = -20 dBm, f = 100 kHz
-58
dB
Typ
Closed-loop output impedance
(single-ended)
f = 1 MHz
0.1
Typ