UCC5606
SLUS347A MAY 1995 REVISED APRIL 2003
9 LINE 3 TO 5 VOLT SCSI ACTIVE TERMINATOR, REVERSE DISCONNECT
1
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FEATURES
D
Complies with SCSI, SCSI2 and SPI2
Standards
D
2.7-V to 5.25-V Operation
D
1.8-pF Channel Capacitance during
Disconnect
D
0.5-
A Supply Current in Disconnect Mode
D
110-
/2.5-k
Programmable Termination
D
Completely Meets SCSI Hot Plugging
D
400-mA Sourcing Current for Termination
D
+400-mA Sinking Current for Active Negation
Drivers
D
Trimmed Termination Current to 4%
D
Trimmed Impedance to 7%
D
Current Limit and Thermal Shutdown
Protection
DESCRIPTION
The UCC5606 provides 9 lines of active termination for
a small computer systems interface (SCSI) parallel bus.
The SCSI standard recommends active termination at
both ends of the cable segment.
The UCC5606 is ideal for high performance 3.3-V SCSI
systems. The key features contributing to such low
operating voltage are the 0.1-V drop out regulator and
the 2.7-V reference. During disconnect the supply
current is typically only 0.5
A, which makes the device
attractive for battery powered systems.
The UCC5606 is designed with an ultra-low channel
capacitance of 1.8 pF, which eliminates effects on signal
integrity from disconnected terminators at interim points
on the bus.
BLOCK DIAGRAM
UDG940671
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
2003, Texas Instruments Incorporated
UCC5606
SLUS347A MAY 1995 REVISED APRIL 2003
2
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DESCRIPTION (CONTINUED)
The UCC5606 can be programmed for either a 110-
or 2.5-k
termination. The 110-
termination is used for
standard SCSI bus lengths and the 2.5-k
termination is typically used in short bus applications. When driving
the TTL compatible DISCNCT pin directly, the 110-
termination is connected when the DISCNCT pin is driven
high, and disconnected when low. When the DISCNCT pin is driven through an impedance between 80 k
and
150 k
, the 2.5-k
termination is connected when the DISCNCT pin is driven high, and disconnected when
driven low.
The power amplifier output stage allows the UCC5606 to source full termination current and sink active negation
current when all termination lines are actively negated.
The UCC5606 is pin-for-pin compatible with Unitrode's other 9-line single-ended SCSI terminators, except that
DISCNCT is now active low, allowing lower capacitance and lower voltage upgrades to existing systems. The
UCC5606 is completely hot pluggable and appears as high impedance at the terminating channels with
V
TRMPWR
= 0 V or open.
Internal circuit trimming is utilized, first to trim the 110-
termination impedance to a 7% tolerance, and then most
importantly, to trim the output current to a 4% tolerance, as close to the maximum SCSI specification as possible,
which maximizes noise margin in fast SCSI operation.
Other features include thermal shutdown and current limit.
This device is offered in low thermal resistance versions of the industry standard 16-pin narrow body SOIC,
16-pin N and 24-pin TSSOP.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
{}
UCC5606
UNIT
TRMPWR voltage
7
V
Signal line voltage
0 to 7
V
Regulator output current
0.6
A
Storage temperature, Tstg
65 to 150
Operating junction temperature, TJ
55 to 150
C
Lead temperature (soldering, 10 sec.)
300
C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is
not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect
to GND. Currents are positive into and negative out of, the specified terminal.
Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and
considerations of packages. All voltages are referenced to GND.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
TRMPWR voltage
2.7
5.25
V
Signal line voltage
0
5
V
Disconnect input voltage
0
TRMPWR
C
ORDERING INFORMATION
T
DISCONNECT
PACKAGED DEVICE
{
TA
DISCONNECT
STATUS
DIL16 (N)
SOIC16 (DP)
TSSOP24 (PWP)
0
C to 70
C
UCC5606N
UCC5606DP
UCC5606PWP
The LQFP packages are available taped and reeled. Add TR suffix to device type (e.g. UCC5606PWPTR) to order quantities of 2,500 devices
per reel.
UCC5606
SLUS347A MAY 1995 REVISED APRIL 2003
3
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CONNECTION DIAGRAM
DIL16 (Top View)
N Package
SOIC16 (Top View)
DP Package
TSSOP24 (Top View)
PWP Package
NOTE: GND* serves as a heat sink ground which must be tied to a large copper area or the grounding plate.
ELECTRICAL CHARACTERISTICS
T
A
= 0
C to 70
C, TRMPWR = 3.3 V, DISCNCT = 3.3 V, R
DISCNCT
= 0
, T
A
= T
J
, (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Supply Current Section
Termpwr supply current
All termination lines = open
1
2
mA
Termpwr supply current
All termination lines = 0.2 V
210
218
mA
Power down mode
DISCNCT = 0 V
0.5
5.0
A
Output Section (110 ohms Terminator Lines)
Terminator impedance
102.3
110.0
117.7
Ohms
Output high voltage
TRMPWR = 3 V (1)
2.5
2.7
3.0
V
VLINE = 0.2 V,
TJ = 25
C
22.1
23.0
24.0
VLINE = 0.2 V
21
23
24
Max output current
VLINE = 0.2 V,
TRMPWR = 3 V,
TJ = 25
C (1)
20.2
23.0
24.0
mA
VLINE = 0.2 V,
TRMPWR = 3 V (1)
19
23
24
VLINE = 0.5 V
22.4
Output leakage
DISCNCT = 0 V,
TRMPWR = 0 V to 5.25 V
10
400
nA
Output capacitance
DISCNCT = 0 V,
DP package (2)
1.8
2.5
pF
Output Section (2.5 k
Terminator Lines) (RDISCNCT = 80 k
)
Terminator impedance
2.0
2.5
3.0
k
Output high voltage
TRMPWR = 3 V (1)
2.5
2.7
3.0
V
Max output current
VLINE = 0.2 V
0.7
1.0
1.4
mA
Max output current
VLINE = 0.2 V,
TRMPWR = 3 V (1)
0.6
1.0
1.5
mA
Output leakage
DISCNCT = 0 V,
TRMPWR = 0 to 5.25 V
10
400
nA
Output capacitance
DISCNCT = 0 V,
DP package (2)
1.8
2.5
pF
UCC5606
SLUS347A MAY 1995 REVISED APRIL 2003
4
www.ti.com
ELECTRICAL CHARACTERISTICS
T
A
= 0
C to 70
C, TRMPWR = 3.3 V, DISCNCT = 3.3 V, R
DISCNCT
= 0
, T
A
= T
J
, (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Regulator Section
Regulator output voltage
5.25 V > TRMPWR > 3 V
2.5
2.7
3.0
V
Drop-out voltage
All termination lines = 0.2 V
0.1
0.2
Short circuit current
VREG = 0 V
200
400
800
mA
Sinking current capability
VREG = 3 V
200
400
800
Thermal shutdown
(2)
170
C
Thermal shutdown hysteresis
(2)
10
Disconnect Section
Disconnect threshold
RDISCNCT = 0 k
to 80 k
0.8
1.5
2.0
V
Input current
DISCNCT = 3.3 V
30
50
A
NOTES:
1. Measuring each termination line while other eight are low (0.2 V).
2. Ensured by design. Not production tested.
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
NO.
I/O
DESCRIPTION
DISCNCT
7
I
Taking this pin low causes the 9 channels to become high impedance and the chip to go into low
power mode. In short laptop buses an 80-k
to 150-k
resister to TERPWR terminates the bus at
2.5 k
.
Less than 110
to TERPWR enables the terminator.
GND
9
Ground reference for the device
LINE1 TO
LINE9
4
I
110-
termination channels
REG
9
I
Output of the internal 2.7-V regulator
TRMPWR
4
Power for the device
GND*
Heat sink ground, must be tied to a large copper area or the grounding plate.
UCC5606
SLUS347A MAY 1995 REVISED APRIL 2003
5
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APPLICATION INFORMATION
UDG98100
Figure 1. Typical SCSI Bus Configurations Utilizing two UCC5606 Devices
UDG98100
Figure 2. Typical Wide SCSI Bus Configurations Utilizing three UCC5606 Devices
UCC5606
SLUS347A MAY 1995 REVISED APRIL 2003
6
www.ti.com
MECHANICAL DATA
PWP (R-PDSO-G**)
PowerPAD
PLASTIC SMALL-OUTLINE
4073225/F 10/98
0,50
0,75
0,25
0,15 NOM
Thermal Pad
(See Note D)
Gage Plane
28
24
7,70
7,90
20
6,40
6,60
9,60
9,80
6,60
6,20
11
0,19
4,50
4,30
10
0,15
20
A
1
0,30
1,20 MAX
16
14
5,10
4,90
PINS **
4,90
5,10
DIM
A MIN
A MAX
0,05
Seating Plane
0,65
0,10
M
0,10
0
8
20 PINS SHOWN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusions.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
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Copyright
2003, Texas Instruments Incorporated
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