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Электронный компонент: TPC8209

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TPC8209
2003-02-18
1
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (U-MOS II)
TPC8209
Lithium Ion Battery Applications
Portable Equipment Applications
Notebook PC Applications


l Small footprint due to small and thin package
l Low drain-source ON resistance: R
DS (ON)
= 30 m (typ.)
l High forward transfer admittance: |Y
fs
| = 10 S (typ.)
l Low leakage current: I
DSS
= 10 A (max) (V
DS
= 30 V)
l Enhancement-mode: V
th
= 1.3 to 2.5 V (V
DS
= 10 V, I
D
= 1 mA)
Maximum Ratings
(Ta = 25C)
Characteristics Symbol
Rating
Unit
Drain-source voltage
V
DSS
30 V
Drain-gate voltage (R
GS
= 20 k) V
DGR
30 V
Gate-source voltage
V
GSS
20 V
D C
(Note 1)
I
D
5
Drain current
Pulse (Note
1) I
DP
20
A
Single-device
operation
(Note
3a)
P
D (1)
1.5
Drain power
dissipation
(t = 10s)
(Note 2a)
Single-device value
at dual operation
(Note 3b)
P
D(2)
1.1
W
Single-device
operation
(Note
3a)
P
D (1)
0.75
Drain power
dissipation
(t = 10s)
(Note 2b)
Single-device value
at dual operation
(Note 3b)
P
D (2)
0.45
W
Single pulse avalanche energy
(Note
4)
E
AS
32.5 mJ
Avalanche current
I
AR
5 A
Repetitive avalanche energy
Single-device value at dual operation
(Note 2a, 3b, 5)
E
AR
0.1 mJ
Channel temperature
T
ch
150
C
Storage temperature range
T
stg
-55~150 C
Note: For (Note 1), (Note 2), (Note 3) and (Note 4), please refer to the
next page.
This transistor is an electrostatic sensitive device. Please handle with caution.
Unit: mm
JEDEC
JEITA
TOSHIBA 2-6J1E
Weight: 0.08 g (typ.)
Circuit Configuration
8 7 6 5
1 2 3 4
TPC8209
2003-02-18
2
Thermal Characteristics
Characteristics Symbol
Max
Unit
Single-device operation
(Note 2a)
R
th (ch-a) (1)
83.3
Thermal resistance, channel to ambient
(t = 10s)
(Note 1a) Single-device value at
dual operation
(Note 2b)
R
th (ch-a) (2)
114
Single-device operation
(Note 2a)
R
th (ch-a) (1)
167
Thermal resistance, channel to ambient
(t = 10s)
(Note 2b) Single-device value at
dual operation
(Note 2b)
R
th (ch-a) (2)
278
C/W
Marking (Note 6)
Note 1: Please use devices on condition that the channel temperature is below 150C.
Note 2:
a) Device mounted on a glass-epoxy board (a)
b)
Device mounted on a glass-epoxy board (b)

Note 3:
a) The power dissipation and thermal resistance values are shown for a single device.
(During single-device operation, power is only applied to one device.)
b) The power dissipation and thermal resistance values are shown for a single device.
(During dual operation, power is evenly applied to both devices.)
Note 4: V
DD
= 24 V, T
ch
= 25C (initial), L = 1.0 mH, R
G
= 25 , I
AR
= 5 A
Note 5: Repetitive rating: pulse width limited by maximum channel temperature
Note 6:
on lower left of the marking indicates Pin 1.
FR-4
25.4
25.4 0.8
(unit: mm)
(a)
FR-4
25.4
25.4 0.8
(unit: mm)
(b)
Type
TPC8209
Lot No.
Weekly code:
(Three digits)
Week of manufacture
(01 for first week of year, continues up to 52 or 53)
Year of manufacture
(One low-order digits of calendar year)
TPC8209
2003-02-18
3
Electrical Characteristics
(Ta = 25C)
Characteristics Symbol Test
Condition Min
Typ.
Max
Unit
Gate leakage current
I
GSS
V
GS
= 16 V
, V
DS
= 0 V
--
10
A
Drain cut-OFF current
I
DSS
V
DS
= 30 V
, V
GS
= 0 V
10 A
V
(BR) DSS
I
D
= 10 mA
, V
GS
= 0 V
30
Drain-source breakdown voltage
V
(BR) DSS
I
D
= 10 mA
, V
GS
=
-20 V
15
V
Gate threshold voltage
V
th
V
DS
= 10 V,
I
D
= 1 mA
1.3
2.5 V
R
DS (ON)
V
GS
= 4.0 V,
I
D
= 2.5 A
43 60
Drain-source ON resistance
R
DS (ON)
V
GS
= 10 V,
I
D
= 2.5 A
30 40
m
Forward transfer admittance
|Y
fs
| V
DS
= 10 V,
I
D
= 2.5 A
5 10 S
Input capacitance
C
iss
600
Reverse transfer capacitance
C
rss
95
Output capacitance
C
oss
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
160
pF
Rise time
tr
4
Turn-ON time
t
on
10
Fall time
t
f
9
Switching time
Turn-OFF time
t
off

Duty <= 1%, t
w
= 10 ms
35
ns
Total gate charge
(Gate-source plus gate-drain)
Q
g
15
Gate-source charge
Q
gs
11
Gate-drain ("miller") charge
Q
gd
V
DD
24 V, V
GS
= 10 V, I
D
= 5 A
4
nC
Source-Drain Ratings and Characteristics
(Ta =
25C)
Characteristics Symbol Test
Condition Min
Typ.
Max
Unit
Drain reverse current Pulse (Note 1)
I
DRP
-- --
--
20
A
Forward voltage (diode)
V
DSF
I
DR
= 5 A, V
GS
= 0 V
-- -- -1.2
V


















R
L

=
6
W
V
DD
~
- 15 V
0 V
V
GS
10 V
4.
7
W
I
D
= 2.5 A
V
OUT
TPC8209
2003-02-18
4



























I
D
V
DS
Drain-source voltage V
DS
(V)
D
r
ai
n
cu
rre
nt

I
D
(A
)
I
D
V
DS
Drain-source voltage V
DS
(V)
D
r
ai
n
cu
rre
nt

I
D
(A
)
I
D
V
GS
Gate-source voltage V
GS
(V)
D
r
ai
n
cu
rre
nt

I
D
(A
)
V
DS
V
GS
D
r
ai
n
-
so
urc
e
v
o
l
t
a
ge

V
DS
(V
)
Gate-source voltage V
GS
(V)
|Y
fs
| I
D
Fo
rw
ar
d t
r
a
n
sfe
r

ad
mi
ttanc
e


Y
fs

(
S
)
Drain current I
D
(A)
R
DS (ON)
I
D
Drain current I
D
(A)
D
r
ai
n
-
so
urc
e
O
N
r
e
si
stanc
e
R
DS (ON)
(m
W
)
0
2
4
6
8
10
0
0.2
0.4
0.6
0.8
1
3.0
3.2
2.8
10
VGS=2.5V
3.5
6
4
8
3.1
2.9
2.6
2.7
Com m on source
Ta
= 25C
P ulse test
0
4
8
12
16
20
0
1
2
3
4
5
VGS=2.5V
3.2
3.5
3.1
3.0
10
2.8
4
8
6
2.9
2.7
2.6
Common source
Ta
= 25C
Pulse test
0
4
8
12
0
1
2
3
4
5
6
25
100
T=-55
Common source
VDS = 10 V
Pulse test
0
0.1
0.2
0.3
0.4
0.5
0.6
0
2
4
6
8
10
12
ID=5A
2.5
1.3
Common source
Ta
= 25C
Pulse test
0.1
1
10
100
0.1
1
10
100
T=-55
100
25
Common source
VDS = 10 V
Pulse test
1
10
100
1000
0.1
1
10
100
VGS=4V
10
Common source
Ta
= 25C
Pulse test
TPC8209
2003-02-18
5













R
DS (ON)
Ta
Ambient temperature Ta (C)
D
r
ai
n
-
so
urc
e
O
N
r
e
si
stanc
e

R
DS
(
O
N)
(
W
)
I
DR
V
DS
Drain-source voltage V
DS
(V)
D
r
ai
n
re
ver
s
e c
u
r
r
e
n
t

I
DR
(
A
)
Capacitance V
DS
Drain-source voltage V
DS
(V)
C
apaci
t
anc
e C
(p
F)
V
th
Ta
Ambient temperature Ta (C)
Gate
th
res
hol
d vol
t
a
ge

V
th
(
V
)
P
D
Ta
D
r
ai
n
po
w
e
r
di
ssi
p
a
ti
on


P
D
(W
)
Ambient temperature Ta (C)
0
0
0.5
1.0
1.5
2
50 100
150 200
(1) Device mounted on a
glass-epoxy board (a)
(Note 2a)
(2) Device mounted on a
glass-epoxy board (b)
(Note 2b)
t
= 10 s
(1)
(2)
(3)
(4)
Dynamic input/output characteristics
D
r
ai
n
-
so
urc
e
v
o
l
t
a
ge

V
DS
(V
)
Gate
-so
u
r
c
e
v
o
l
t
age
V
GS
(V
)
Total gate charge Q
g
(nC)
0
20
40
60
80
100
-80
-40
0
40
80
120
160
10V
VGS=4V
1.3
ID=1.3/2.5/5.0A
2.5
ID=5.0A
Common source
Pulse test
0.1
1
10
100
0
0.4
0.8
1.2
1.6
2
10
5
3
1
VGS=0V,-1V
-
-
-
-
-
Common source
Ta
= 25C
Pulse test
10
100
1000
10000
0.1
1
10
100
Ciss
Crss
Coss
Common source
VGS = 10 V
ID = 1 mA
Pulse test
0
1
2
3
4
5
-80
-40
0
40
80
120
160
Common source
V
DS
= 10 V
f
= 1 mA
Pulse test
0
10
20
30
40
0
5
10
15
20
25
30
0
10
20
30
VDS
VGS
VDD=24V
12
6
40
Common source
Ta
= 25C
I
D
= 8 A
Pulse test
TPC8209
2003-02-18
6

































Drain-source voltage V
DS
(V)
D
r
ai
n
cu
rre
nt

I
D
(A
)
Safe operating area
Pulse width t
w
(S)
r
th
- t
w
Norm
al
i
z
ed t
r
ans
i
e
n
t
t
herm
a
l
i
m
pe
danc
e
r
th
(

C
/
W
)
0.1
1
10
100
1000
0.001
0.01
0.1
1
10
100
1000
Single pulse
Device mounted on a glass-epoxy board (a) (Note 2a)
(1) Single-device operation (Note 3a)
(2) Single-device value at dual operation (Note 3b)
Device mounted on a glass-epoxy board (b) (Note 2b)
(3) Single-device operation (Note 3a)
(4) Single-device value at dual operation (Note 3b)
t
= 10 s
(1)
(2)
(3)
(4)
0.1
1
10
100
0.1
1
10
100
* Single pulse
Ta
= 25C
Curves must be derated
linearly with increase in
temperature.
ID max (pluse) *
VDSS max
1 ms*
10 ms*
TPC8209
2003-02-18
7
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devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
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conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability
Handbook" etc..
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(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
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extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
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document shall be made at the customer's own risk.
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
The information contained herein is subject to change without notice.
000707EAA
RESTRICTIONS ON PRODUCT USE