TPS850
2002-03-29
1
TOSHIBA Photo IC Silicon Epitaxial Planar
TPS850
Mobile Phones, PHS, Pagers
Notebook PCs, PDAs
Video Cameras, Digital Still Cameras
Other Equipment Requiring Luminosity Adjustment
The TPS850 is a linear-output photo-IC which incorporates a photodiode
and a current amp circuit in a single chip. This photo-IC is current
output type, so can set up output voltage freely by arbitrary load
resistance.
High sensitivity: I
L
= 230 A
@E
V
= 100 lx (typ.) Using the fluorescent light
Little fluctuation in light current
: Width range = x1 to x1.6 (typ. 25%)
Output linearity of illuminance is excellent
Open-emitter output
Compact and light surface-mount package
Pb-free
Maximum Ratings
(Ta
=
=
=
=
25C)
Characteristics Symbol
Rating
Unit
Supply voltage
V
CC
-
0.5 to 7
V
Output voltage
V
OUT
<
=
V
CC
V
Light current
I
L
10
mA
Permissible power dissipation
P
70
mW
Operating temperature range
T
opr
-
30 to 85
C
Storage temperature range
T
stg
-
40 to 100
C
Soldering temperature range (10 s)
(Note 1)
T
sol
260
C
Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling
Precautions.
Recommended Operating Conditions
Characteristics Symbol
Min
Typ.
Max
Unit
Supply voltage
V
CC
2.2
5.5 V
TOSHIBA
Weight: 0.017 g (typ.)
TPS850
2002-03-29
2
Electrical and Optical Characteristics
(Ta
=
=
=
=
25C)
Characteristics Symbol
Test
Condition
Min
Typ.
Max
Unit
Supply current
I
CC
V
CC
=
3 V, E
V
=
1000 lx,
R
L
=
250
W
(Note
2)
4
mA
Light current (1)
I
L
(1)
V
CC
=
3 V, E
V
=
100 lx
(Note
2,
4)
300
Light current (2)
I
L
(2)
V
CC
=
3 V, E
V
=
10 lx
(Note
3,
4)
18 23 30
Light current (3)
I
L
(3)
V
CC
=
3 V, E
V
=
100 lx
(Note
3,
4)
180
230 300
m
A
Light current ratio
(3)
L
I
(1)
L
I
1.3
1.7
Dark current
I
LEAK
V
CC
=
3.3 V, E
V
=
0
0.5
m
A
Saturation output voltage
Vo
V
CC
=
3 V, R
L
=
75 k
W,
E
V
=
100 lx
(Note 3)
2.2 2.35
V
Peak sensitivity wavelength
l
p
640
nm
Rise time
t
r
0.2 1
Switching time
Fall time
t
f
V
CC
=
3 V, R
L
=
5 k
W
,
(Note
5)
0.35 2
ms
Note 2: CIE standard A light source is used (color temperature
=
2856K, approximated incandescence light).
Note 3: Fluorescence light is used as light source. However, white LED is substituted in a mass-production process.
Note 4: Light current measurement circuit
Note 5: Rise time/fall time measurement method
A
OUT
V
CC
I
L
TPS850
Light
source
OUT
V
CC
White LED
Pulse drive
TPS850
R
L
t
f
t
r
I
F
1.5 V
V
OUT
GND
90%
10%
TPS850
2002-03-29
3
Package Dimensions
Weight: 0.017 g (typ.)
Block Diagram
Current
amp
3 V
CC
4 OUT
1 GND
2 GND
TPS850
2002-03-29
4
Handling Precautions
At power-on in darkness, the internal circuit takes about 50 ms to stabilize. During this period the output signal
is unstable and may change. Please take this into account.
Moisture-Proof Packing
(1) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica
gel.
(2) Since the optical characteristics of the device can be affected during soldering by vaporization
resulting from prior absorption of moisture and they should therefore be stored under the following
conditions:
Temperature: 5
C to 30
C, Relative humidity: 60% (max), Time: 168 h
(3) Baking is required if the devices have been store unopened for more than six months or if the
aluminum envelope has been opened for more than 168 h.
These devices are packed on tapes; hence, please avoid baking at high temperature.
Recommended baking conditions: 60
C for 12 h or longer
Mounting Precautions
(1) Do not apply stress to the resin at high temperature.
(2) The resin part is easily scratched, so avoid friction with hard materials.
(3) When installing the assembly board in equipment, ensure that this product does not come into
contact with other components.
Mounting Methods
(1) Reflow
soldering
Package surface temperature: 260C (max)
Please perform reflow soldering using the following reference temperature profile.
Perform reflow soldering no more than twice.
Please perform the first reflow soldering within 168 h after opening the package with reference to
the above temperature profile.
Second reflow soldering
In case of second reflow soldering, it should be performed within 168 h after first reflow under the
above conditions.
Storage conditions before second reflow soldering: 30C, 60% RH or lower
Do not perform flow soldering.
Make any necessary soldering correction manually.
(do not do this more than once for any given pin.)
Temperature: no more than 350C (25 W for soldering iron)
Time: within 5 s
30 s to 50 s Heating part
Time (s)
60 s to 120 s
Tem
perat
ure (
C)
260C max
230C
190C
180C
Preheating part
TPS850
2002-03-29
5
(2) Recommended
soldering
pattern
(3) Cleaning
conditions
When cleaning is required after soldering
Chemicals: AK225 alcohol
Temperature and time: 50C 30 s or : 30C 3 mins
Ultrasonic cleaning: 300 W or less
Packing Specification
(1) Packing
quantity
Reel (minimum packing quantity)
3000 devices
Carton
5 reels (15000 devices)
(2) Packing
format
An aluminum envelope containing silica gel and reels is deaerated and sealed.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
Carton specification
Carton
dimensions
(W)
81
mm
(L) 280 mm (H) 280 mm
1.6 1.6
1.3
0.
95
0.
95 0.
6
Unit: mm
Label
TPS850
2002-03-29
6
4.0
0.1
f
1.5
+
0.1
0
2.0
0.05
A
A'
Feed direction
Device Orientation
4.0
0.1
0.2
0.05
1.3
0.1
A-A'
B-B'
max 6
2.8
0.1
max 6
3.
6
0.
1
8.
0
0.
2
1.
75
0.
1
ma
x
6
ma
x
6
3.
5
0.
1
(2.
75)
B
B'
Tape Packing Specifications
(1) Reel
dimensions
(2) Tape
dimensions
(3) Packing quantity: 3000/reel
2
0.5
f
180
+
0
-
4
f
21
0.3
f
13
0.5
Label
f
60
9
0.3
11.4
1
TPS850
2002-03-29
7
P Ta
I
LEAK
Ta
(typ.)
0
0
80
20 40 60 80 100
60
40
20
10
70
50
30
Re
la
tiv
e
lig
h
t
c
u
r
r
e
n
t
Re
la
tiv
e
lig
h
t
c
u
r
r
e
n
t
Ambient temperature Ta (C)
P
o
w
e
r
di
ssi
p
a
ti
on
P
(
m
W
)
Ambient temperature Ta (C)
Dar
k
cur
r
e
n
t I
L
EAK
(
m
A)
Illuminance E
V
(lx)
I
L
E
V
(typ.)
Li
ght
cu
rr
ent
I L
(
m
A)
Ambient temperature Ta (C)
Relative I
L
Ta
(typ.)
Supply voltage VCC (V)
Relative I
L
V
CC
(typ.)
Illuminance E
V
(lx)
Vo E
V
(typ.)
Outp
ut
vol
t
ag
e V
o
(V
)
10
0.001
20
VCC
=
3 V
Please refer to Figure 2.
1
0.1
0.01
40 60 80 100
Ta
=
25C
Please refer to Figure 1.
0
2
1.6
7
3 4 5 6
1.2
0.8
0.4
1
1
10000
10 100 1000
10000
1000
100
10
Ta
=
25C
VCC
=
3 V
Please refer to Figure 1.
A light source
Fluorescent
light
1.4
0.6
-
40
1.2
1.0
0.8
-
20 0 20 40 60 80 100
VCC
=
3 V
Please refer to Figure 1.
Fluorescent
light
A light source
10 100 1000
10000
10
0.0001
1
1
0.1
0.01
0.001
Ta
=
25C
VCC
=
3 V
Please refer to Figure 4.
Fluorescent
light
RL
=
250
W
Fluorescent
light
RL
=
5 k
W
A light source
RL
=
250
W
A light source
RL
=
5 k
W
TPS850
2002-03-29
8
Illuminance E
V
(lx)
I
CC
E
V
(typ.)
C
ons
um
pti
o
n
cu
rr
ent
I
CC
(m
A
)
Load resistance RL (k
W
)
Switching characteristics
(Non-saturating
operation)
(typ.)
Switch
in
g
ti
m
e
(
m
s)
Switch
in
g
ti
m
e
(
m
s)
Load resistance RL (k
W
)
Switching characteristics
(Saturating
operation)
(typ.)
R
e
l
a
ti
v
e
c
ons
um
pti
o
n cu
rr
ent
Ambient temperature Ta (C)
Relative I
CC
Ta
(typ.)
VCC
=
3 V
Using the Fluorescent light
RL = 1 k
W
Please refer to Figure 3.
1.40
0.60
-
40
1.20
1.00
0.80
-
20 0 20 40 60 80 100
tf
td
tr
ts
1
Ta
=
25C
VCC
=
3 V
VOUT
=
1.5 V
Using the White LED
Please refer to Figure 5.
0.1
0.1
10
1000
100
10
1
300
30
3
0.3
0.3
3
tf
Ta
=
25C
VCC
=
3 V
VOUT
>
=
2 V
Using the White LED
Please refer to Figure 5.
1000
0.1
0.1 10
ts
td
tr
100
10
1
1
300
30
3
0.3
0.3
3
10 100 1000
10000
10
0.001
1
1
0.3
0.03
0.1
3
0.01
0.003
Ta
=
25C
VCC
=
3 V
Using the A light source
Please refer to Figure 3.
RL
=
250
W
RL
=
1000
W
RL
=
5000
W
TPS850
2002-03-29
9
Measurement Circuits
Spectral response
(typ.)
Re
la
tiv
e
s
e
n
s
itivi
t
y
Relative sensitivity
Radiation
pattern
(typ.)
Wavelength
l
(nm)
Ta
=
25C
Luminosity angle
30
0
60
90
90
30
60
1.0
0.8
0.6
0.4
0.2
0
80
70
50
40
20
10
70
80
50
40
20
10
TPS850
V
CC
Figure 4 Output voltage measurement circuit
R
L
V Vo
Light
TPS850
V
CC
OUT
Icc
A
Figure 3 Consumption current measurement circuit
R
L
Light
Pulse drive
TPS850
White LED
V
CC
OUT
R
L
Figure 5 Switching measurement circuit and waveform
Figure 1 Light current measurement circuit
TPS850
V
CC
OUT
IL
A
Light
Figure 2 Dark current measurement circuit
TPS850
V
CC
OUT
I
LEAK
A
t
f
t
r
t
s
t
d
I
F
1.5 V
V
OUT
GND
90%
10%
0
200
1
1200
400 600 800
0.2
0.4
0.6
0.8
1000
Ta
=
25C
TPS850
2002-03-29
10
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability
Handbook" etc..
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer's own risk.
The products described in this document are subject to the foreign exchange and foreign trade laws.
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
The information contained herein is subject to change without notice.
000707EBA
RESTRICTIONS ON PRODUCT USE
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