E2581-Type 10 Gb/s EML Modules
for up to 80 km Transmission
Data Sheet
March 2003
Features
Integrated electroabsorption modulator
1.5
m wavelength--full C-band
Characterized for 10 Gb/s operation
For use up to 80 km at 10 Gb/s
Low modulation voltage
Temperature stabilized
Integral driver IC
Wavelength selectable to ITU-T standards
Ultrastable wavelength aging for DWDM
Applications
SONET/SDH applications
Ultrahigh capacity WDM system application
High-speed data communication
Digitized video
Description
The E2581-series EML with integral driver IC is
designed for 10 Gb/s DWDM or TDM transmission
applications. It integrates a CW laser with an electroab-
sorption modulator in the same semiconductor chip.
These devices can replace external modulators that
are often bulkier, more expensive, and require more
drive electronics than the EML. The E2581 uses an
SMP-type, subminiature, push-on connector to handle
the RF signal. The package also contains a thermo-
electric cooler, thermistor, rear-facet monitor photo-
diode, and an optical isolator. The E2581-series
operates over distances of 80 km.
The nominal input impedance of the E2581 is 50
.
The package is qualified to the Telcordia Technolo-
giesTM TA-TSY-000468 standard.
The E2581 is available in the full range of C-band ITU-
T wavelengths for use in DWDM systems operating at
10 Gb/s per channel. The device exhibits excellent
wavelength stability, supporting operation at 100 GHz
channel spacing over 20 years (assuming an end-of-
life aging condition of <100 pm). Typically, external
wavelength stabilization is not required in systems of
this type, using TriQuint's EML products. The package
also offers excellent stability of wavelength vs. case
temperature, with a maximum coefficient of
0.5 pm/C.
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For additional information and latest specifications, see our website: www.triquint.com
E2581-Type 10 Gb/s EML Modules
Data Sheet
for up to 80 km Transmission
March 2003
Module Characteristics
Table 1. Module Characteristics
Pin Information
Table 2. Pin Descriptions
Note: For full details of pin functions and required bias levels for the version with the IC, refer to the forthcoming Application Note, E2581 EML
with Integral Driver IC: Pin Definitions And Operation .
Parameter
Description
Package Type
E2581: 13-pin package with SMP-type connector RF input.
Fiber
Standard single-mode fiber.
Fiber Length
33 inches (838.2 mm) minimum.
Connector
Various connectors available on request.
RF Input
Impedance 50
.
Pin Number
Pin Name
Description
1
THERM, LASER, CASE
Combined thermistor/laser cathode/case
2
THERM
Thermistor
3
LASER+
Laser anode
4
BACK DET
Monitor anode
5
BACK DET+
Monitor cathode+
6
VEA
Modular offset
7
NC
No connect/reserved
8
NC
No connect/reserved
9
OA
Optical amplitude adjust
10
DCA
Duty cycle adjust
11
V
SS
Voltage supply to the IC
12
TEC+
Thermoelectric cooler+
13
TEC
Thermoelectric cooler
For additional information and latest specifications, see our website: www.triquint.com
3
Data Sheet
E2581-Type 10 Gb/s EML Modules
March 2003
for up to 80 km Transmission
Target Specifications
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Table 3. Absolute Maximum Ratings
Characteristics
Minimum and maximum values specified over operating case temperature range. Typical values are measured at
room temperature unless otherwise noted.)
Table 4. Optical and Electrical Specifications (Chip operating temp. = 15
C to 35 C, except where noted.)
Parameter
Conditions
Min
Max
Unit
Laser Diode Reverse Voltage
CW
--
2
V
Laser Diode Forward Current
CW
--
150
mA
Optical Output Power
CW
--
10
mW
Modulator Reverse Voltage
--
--
3.5
V
Modulator Forward Voltage
--
--
1
V
Monitor Diode Reverse Voltage
--
--
10
V
Monitor Diode Forward Voltage
--
--
1
V
Storage Temperature
--
40
85
C
Operating Temperature
--
10
70
C
DCA Voltage (pin 10)
--
6.5
0.3
V
OA Voltage (pin 9)
V
OA
V
SS
> 1.2 V
6.5
0.3
V
EA Bias Voltage (pin 6)
V
OA
V
SS
> 2.4 V
6.5
0.3
V
Supply Voltage V
SS
(pin 11)
--
6.5
0.3
V
Parameter
Symbol
Conditions
Min
Max
Unit
Threshold Current (BOL)
I
TH
--
5
35
mA
Forward Voltage
V
F
I
F
= I
OP
@ T
OP
--
2.2
V
Operating Current
I
OP
--
50
100
mA
Threshold Power
P
TH
I
F
I
TH
V
M
= 0 V
--
80
W
Fiber Output Power (average)
P
AVG
Note 1
2
--
dBm
Peak Wavelength
(Wavelength can be specified to
the ITU wavelength
channels.)
PK
Note 1
1528.7
1563.9
nm
Side-mode Suppression Ratio
SMSR
VM = 0 V
I
F
= I
OP
,T
OP
35
--
dB
Dispersion Penalty
BER = 10
10
DP
Notes 1, 2
--
2.0
dB
1. I
F
= I
OP
; T = T
OP
; modulated for 80 km operation.
2. 1600 ps/nm, at V
EA,
V
XOVR
, V
P-P
(operating parameters for 80 km will be provided)
.
4
For additional information and latest specifications, see our website: www.triquint.com
E2581-Type 10 Gb/s EML Modules
Data Sheet
for up to 80 km Transmission
March 2003
1. I
F
= I
OP
; T = T
OP
; modulated for 80 km operation.
2. Over 1600 ps/nm, at V
EA,
V
XOVR
, V
P-P
(operating parameters for 80 km will be provided).
3. T
CASE
= 70
C, T
LASERCHIP
= 20
C to 35 C.
Modulator/Driver
Extinction Ratio
ER
RF
Note 1.
10
--
dB
RF Return Loss
(100 MHz to 10 GHz)
S
11
--
--
-10
dB
Rise/Fall Time
(20%--80%)
t
R
/t
F
--
--
40
ps
Monitor Diode
Monitor Current
I
BD
V
BD
= 5 V
I
F
= I
OP
40
1100
A
Dark Current
I
D
V
BD
= 5 V
--
0.1
A
Capacitance
C
V
BD
= 5 V
F = 1 MHz
--
25
pF
Thermistor
Resistance
R
THERM
T = 25
C
9.8
10.2
k
Thermistor Current
I
TC
--
10
100
A
Thermistor B Constant
B
--
3700
4100
--
Thermoelectric Cooler
TEC Current
I
TEC
Note 3.
--
1.1
A
TEC Voltage
V
TEC
Note 3.
--
2.6
V
TEC Power
P
TEC
Note 3.
--
2.9
W
TEC Capacity
T
Note 3.
55
--
C
Optical Isolation
Optical Isolation
--
Note 3.
30
--
dB
Package
Wavelength vs. Case Temp.
d
/ dT
T
CASE
= 10
C to +70 C
0.5
0.5
pm/
C
Parameter
Symbol
Conditions
Min
Max
Unit
Target Specifications
(continued)
Table 4. Optical and Electrical Specifications (Chip operating temp. = 15
C to 35 C, except where noted.)
(continued)
For additional information and latest specifications, see our website: www.triquint.com
5
Data Sheet
E2581-Type 10 Gb/s EML Modules
March 2003
for up to 80 km Transmission
Outline Diagram
Dimensions are in inches and (millimeters).
0.291
(7.38)
0.215
(5.47)
0.078
(1.98)
0.050
(1.27)
0.020
(0.51)
0.350
(8.89)
0.500
(12.7)
0.551
(13.99)
0.500
(12.7)
LEAD 13
LEAD 1
TRADEMARK CODE LASER SERIAL NUMBER
AND DATE CODE LABEL IN AREA SHOWN
BEND LIMITER
0.498
(12.64)
1.025
(26.04)
0.106
(2.7)
0.190
(4.82)
12 PLACES
CONNECTOR TYPE
AS SPECIFIED
1.180
(29.97)
2.024
(51.41)
0.820
(20.83)
33.0
0.56
(1.42)
0.365
(9.27)
0.180
(4.56)
0.030
(0.75)
0.228
(5.78)
0.98
(2.5)
0.260
(6.6)
0.200
(5.08)
0.010
0.002
(0.25
0.064)
3 PLACES
0.215
(5.45)
(838.20)
MIN
4 PLACES
0.355
(9.00)
0.154
(3.91)
MIN.
1-1319F
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