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Электронный компонент: TQM713019

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TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
1
Features
InGaP HBT Technology
High Efficiency: 41% CDMA
Low Leakage Current: < 1uA
Low Icq = 55mA
Supports new chipsets with Vref @ 2.6V
Capable of running as 0-bit PA in low bias
mode to 28dBm
Optimized for 50 system
Small 10 pin 4x4mm module
Excellent Rx band noise performance
CDMA 1XRTT, 1XEV-DO compliant
Full ESD protection
Applications
IS-95 / CDMA2000
Single mode, dual mode, and tri mode
CDMA/AMPS phones
Package Style
4mm x 4mm LGA package

Functional Block Diagram
Product Description
The TQM713019 is a 3V, 2 stage GaAs HBT Power Amplifier Module designed for
use in mobile phones. Its extremely small 4x4mm package makes it ideal for
today's compact data enabled phones. Its RF performance meets the
requirements for products designed to IS-95/98 standards.
The TQM713019 is designed on TriQuint's advanced InGaP HBT GaAs
technology offering state of the art reliability, temperature stability, and
ruggedness. Selectable bias mode and a shutdown mode with low leakage
current improves talk and standby time. The output match, realized within the
module package, optimizes efficiency/linearity at maximum rated output power.
The module is a 4x4mm land grid array with backside ground. The TQM713019 is
footprint compatible with industry standard 4x4mm CDMA PA modules.
Electrical Specifications











Parameter Min
Typ
Max
Units
Frequency 824
849
MHz
CDMA mode maximum Pout
1
28 dBm
Gain
29
dB
CDMA ACPR
50
dBc
CDMA ALTR
65
dBc
Power Supply Current @ 28dBm
450
mA
I
REF
2.0 mA
Rx Band Noise
-140
dBm/Hz
6
7
8
9
10
5
4
3
2
1
Vcc1
RFin
GND
Vmode
Vref
Vcc2
GND
RFout
GND
GND
1 Bit Bias Control
Note 1 : CDMA Mode: V
CC1
=3.4VDC, V
CC2
=3.4VDC, V
REF
=2.85VDC, Tc=25C
Data Sheet: Subject to change without notice
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
2
Absolute Maximum Ratings
Symbol
Parameter
Absolute Maximum Value
Units
P
IN
RF Input Power
10
dBm
V
CC
Supply Voltage
0.0 to 5.0
V
DC
V
REF
Reference Voltage
0.0 to 3.5
V
DC
V
MODE
Vmode (1 bit Bias Control)
0.0 to 3.5
V
DC
T
CASE
Case Operating Temperature
-40 to +100
C
T
STORE
Storage Temperature
-55 to +150
C
Note: The part may not survive all maximums applied simultaneously.
Recommended Operating Conditions
Symbol Parameter
Min.
Typ/Nom
Max.
Units
V
CC
Supply Voltage
3.2
3.4
4.2
V
DC
V
REF
Reference Voltage
PA On
2.70
2.85
2.95
V
DC
PA Off
0
<0.5
-
V
DC
V
MODE
Vmode (1 bit Bias Control)
High Bias Mode
0
-
0.5
V
DC
Low Bias Mode
2.5
2.85
3.0
V
DC
T
CASE
Case Operating Temperature
-30
25
+85
C
Power Range Truth Table
Parameter V
REF
V
MODE
Range
High Power
2.85 V
Low
16 dBm 28 dBm
Low Power
2.85 V
High
< 16 dBm
Shut Down
0.0 V
Low
-
Data Sheet: Subject to change without notice
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
3
CDMA (IS-98C) Electrical Characteristics
1
Parameter Conditions
Min.
Typ/Nom
Max.
Units
RF Frequency
824
849
MHz
Large Signal Gain
V
CC
= 3.2 to 4.2V; V
REF
= 2.85V; -30 C < Temp < 85C
Pout = +28 dBm
25
29
33
dB
Pout = +16 dBm
23
27
dB
Adjacent Channel Power (ACPR1)
2
V
CC
= 3.2 to 4.2V; V
REF
= 2.85V; -30 C < Temp < 85C
+16dBm Pout +28dBm
-50
-45
dBc
Pout +16dBm
-52
-45
dBc
Adjacent Channel Power (ACPR2)
2
V
CC
= 3.2 to 4.2V; V
REF
= 2.85V; -30 C < Temp < 85C
+16dBm Pout +28dBm
-60
-57
dBc
Pout +16dBm
-65
-57
dBc
Quiescent Current
V
CC
= 3.4V; V
REF
= 2.85V; V
MODE
= 2.85V ; Temp = 25 C
55
mA
I
REF
Pout = +28dBm; V
CC
= 3.4V; V
REF
= 2.85V; V
MODE
= 0V;
Temp = 25C
2 3
mA
I
MODE
All Conditions
75
uA
PAE
Pout = +28dBm; V
CC
= 3.4V; V
RE F
= 2.85V; V
MODE
= 0V;
Temp = 25C
41 %
PAE
Pout = +16dBm; V
CC
= 3.4V; V
RE F
= 2.85V; V
MODE
= 2.85V;
Temp = 25C
9.5 %
Input VSWR
All Terminals
1.5 :1
2.0 :1
Harmonics Pout
+28dBm
2fo
-50
-40
dBc
3fo
-65
-40
dBc
Spurious / Stability
Pout +28dBm; 10:1 VSWR; V
CC
= 3.2 to 4.2V;
-30 C < Temp < 85C
-65
dBc
Ruggedness
10:1 VSWR; Pin = +10dBm; -30 C < Temp < 85C
No degradation
Noise Power in Rx Band
Pout = +28dBm, IS-95 Standard
-140
-135
dBm/Hz
Note 1: Test Conditions: V
CC
=3.4V
DC
, V
REF
=2.85V
DC
, T
C
= 25
C unless otherwise specified; TriQuint Test Board
Note 2: ACPR1 Measured @
885kHz Offset; ACPR2 Measured @
1.98MHz
Data Sheet: Subject to change without notice
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
4
cdma2000 (IS-98D) Electrical Characteristics
1,3
Parameter Conditions
Min.
Typ/Nom
Max.
Units
RF Frequency
824
849
MHz
Large Signal Gain
V
CC
= 3.2 to 4.2V; V
REF
= 2.85V; -30 C < Temp < 85C
Pout = +27.5 dBm
25
28.5
dB
Pout = +16 dBm
23
27
dB
Adjacent Channel Power (ACPR1)
2
V
CC
= 3.2 to 4.2V; V
REF
= 2.85V; -30 C < Temp < 85C
+16dBm Pout +27.5dBm
-50
-45
dBc
Pout +16dBm
-55
-45
dBc
Adjacent Channel Power (ACPR2)
2
V
CC
= 3.2 to 4.2V; V
REF
= 2.85V; -30 C < Temp < 85C
+16dBm Pout +27.5dBm
-60
-57
dBc
Pout +16dBm
-65
-57
dBc
Quiescent Current
V
CC
= 3.4V; V
REF
= 2.85V; V
MODE
= 2.85V ; Temp = 25 C
55
mA
I
REF
Pout = +27.5dBm; V
CC
= 3.4V; V
REF
= 2.85V; V
MODE
= 0V;
Temp = 25C
2 3
mA
I
MODE
All Conditions
75
uA
PAE
Pout = +27.5dBm; V
CC
= 3.4V; V
RE F
= 2.85V; V
MODE
= 0V;
Temp = 25C
40 %
PAE
Pout = +16dBm; V
CC
= 3.4V; V
RE F
= 2.85V; V
MODE
= 2.85V;
Temp = 25C
9.5 %
Input VSWR
All Terminals
1.5 :1
2.0 :1
Noise Power in Rx Band
Pout = +28dBm, IS-95 Standard
-140
-135
dBm/Hz
Note 1: Test Conditions: V
CC
=3.4V
DC
, V
REF
=2.85V
DC
, T
C
= 25
C unless otherwise specified; TriQuint Test Board
Note 2: ACPR1 Measured @
885kHz Offset; ACPR2 Measured @
1.98MHz
Note 3: 9600 bps Fundamental and Supplemental Traffic Channels (0 dB), peak-to-average ratio (CCDF=1%) = 4.5dB
AMPS Mode Electrical Characteristics
1
Parameter Conditions
Min.
Typ/Nom
Max.
Units
RF Frequency
824
849
MHz
High Power Output, Pout
31.5
dBm
Large Signal Gain
27.5
dB
PAE
Pout = 31.5dBm; V
CC
= 3.4V; Temp = 25C
50
57
%
Note 1: Test Conditions: V
CC
=3.4V
DC
, V
REF
=2.85V
DC
, T
C
= 25
C unless otherwise specified; TriQuint Test Board
Data Sheet: Subject to change without notice
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Data Sheet: Subject to change without notice
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
5
Pin Out and Assignments
6
7
8
9
10
5
4
3
2
1
1 Bit Bias Control
Vref
GND
Vmode
GND
GND
RFout
RFin
GND
Vcc1
Vcc2

Pin
Symbol
Description
1 V
REF
Regulated voltage for bias setting. V
REF
is set to 0V
DC
to
power off the TQM713019
2 V
MODE
1 step bias control
3 GND
Ground
4 RF
IN
RF input. The RF circuit is DC grounded internally
2
. 50
Ohm RF impedance.
5 V
CC1
Collector voltage for input stage
6 V
CC2
Collector voltage for output stage
7 GND
Ground
8 RF
OUT
RF output. The RF circuit is DC blocked internally. 50 Ohm
RF impedance
9 GND
Ground
10 GND
Ground
Paddle
1
GND
Device ground and thermal path for heat removal
Note
1: TriQuint recommends the use of several via holes to the backside ground under the paddle
Note2: Internal DC ground for RF
IN
RFin
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
6
Typical Performance
Test Conditions (Unless Otherwise Specified): V
CC
=3.4V
DC
, V
REF
=2.85V
DC
, V
MODE
= 0 or 2.85V
DC
, P
OUT
=28.0 or 16dBm

Icc @ 836MHz (IS-95 CDMA)
0
100
200
300
400
500
600
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28
Pout (dBm )
I
cc (
m
A
)
-30C
25C
85C
PAE @ 836MHz (IS-95 CDMA)
0.0
10.0
20.0
30.0
40.0
50.0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28
Pout (dBm )
PA
E
(
%
)
-30C
25C
85C



ACPR @ 836MHz (IS-95 CDMA)
-70
-65
-60
-55
-50
-45
-40
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28
Pout (dBm)
ACP
R (
d
Bc
)
-30C
25C
85C
ALTR @ 836MHz (IS-95 CDMA)
-80
-75
-70
-65
-60
-55
-50
0 2
4 6 8 10 12 14 16 18 20 22 24 26 28
Pout (dBm )
AL
T
R
(
d
Bc
)
-30C
25C
85C



Data Sheet: Subject to change without notice
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
7
Typical Performance (Continued)

Gain @ 836MHz (IS-95 CDMA)
20
22
24
26
28
30
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30
Pout (dBm )
G
a
in
(
d
B
)
-30C
25C
85C
PAE @ Pout = 28dBm (IS-95 CDMA)
38.0
40.0
42.0
44.0
46.0
48.0
50.0
824
829
834
839
844
849
Freq (MHz)
PA
E
(
%
)
350
375
400
425
450
475
500
Icc (
m
A
)
85C
25C
-30C



PAE @ Pout = 16dBm (IS-95 CDMA)
2.0
4.0
6.0
8.0
10.0
12.0
824
829
834
839
844
849
Freq (MHz)
PA
E
(
%
)
100
110
120
130
140
150
Icc (
m
A
)
85C
25C
-30C
ACPR and ALTR @ Pout = 28dBm (IS-95
CDMA)
-64
-62
-60
-58
-56
-54
-52
-50
-48
-46
-44
824
829
834
839
844
849
Freq (MHz)
ACP
R (
d
Bc
)
-70
-68
-66
-64
-62
-60
-58
-56
-54
-52
-50
AL
T
R
(
d
Bc
)
-30C
85C
25C
Data Sheet: Subject to change without notice
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Data Sheet: Subject to change without notice
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
8
Typical Performance (Continued)

ACPR and ALTR @ Pout = 16dBm (IS-95
CDMA)
-64
-62
-60
-58
-56
-54
-52
-50
-48
-46
-44
824
829
834
839
844
849
Freq (MHz)
ACP
R (
d
Bc
)
-80
-78
-76
-74
-72
-70
-68
-66
-64
-62
-60
AL
T
R
(
d
Bc
)
-30C
85C
25C
Gain @ Pout = 16dBm and 28dBm (IS-95
CDMA)
22
23
24
25
26
27
28
29
30
31
32
824
829
834
839
844
849
Freq (MHz)
H
i
g
h
P
o
we
r
Ga
i
n
(dB
)
25
26
27
28
29
30
31
32
33
34
35
L
o
w P
o
we
r
Ga
i
n
(dB
)
85C
25C
-30C



TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Data Sheet: Subject to change without notice
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
9
Application Information; tuning procedures; board layout precautions
TriQuint offers our customers the below evaluation board as a means for testing and analysis of TQM713019. The evaluation board
schematic and picture are provided for preliminary analysis and design. Figure 1 shows the TriQuint application board, while Figure 2
shows the schematic of the board.
1 10
Pin #
Function
1 No
Connect
2
Vmode, High/low Bias Mode
3
Vref, Reference Voltage
4 Vcc1,
1
st
Stage Collector Voltage
5
GND, DC Ground
6
GND, DC Ground
7 Vcc2,
2
nd
Stage Collector Voltage
8 Vcc2,
2
nd
Stage Collector Voltage
9
GND, DC Ground
10
GND, DC Ground
OUT
IN
Figure 1: Evaluation Board
TQM713019
Vref
Vmode
GND
RFin
Vcc1
GND
GND
RFout
GND
Vcc2
Vref
Vmode
RFin
Vcc1
RFout
Vcc2
10000 pF
10000 pF
100000 pF
10uF
100000 pF
10uF
GND
@ PADDLE
Figure 2: Evaluation Board Schematic








TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Data Sheet: Subject to change without notice
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
10
PC Board Layout Recommendations
M
J
K
N
D
E
S
T
U

DIMENSION MM
D
3.85
E
4.30
J
0.68
K
0.45
M
0.85
N
1.90
S
3.80
T
2.00
U
1.00

Note1: Only ground signal traces are allowed directly under the package
Note 2: Primary dimensions are in millimeters alternate dimensions are in inches.
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Data Sheet: Subject to change without notice
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
11
Packaging and Ordering Information
Package Type: 10 Pin Plastic Module Package
DESIGNATION
DESCRIPTION DIMENSION
A
OVERALL HEIGHT
1.5
+/-0.12 mm
D
PACKAGE LENGTH
4.0
+/-0.1 mm
E
PACKAGE WIDTH
4.0
+/-0.1 mm
J
SOLDER MASK OPENING LENGTH AND
WIDTH
0.575 +/-0.075 mm
K
METAL PAD LENGTH AND WIDTH
0.40
+/-0.05 mm
P
DISTANCE BETWEEN METAL PAD AND
PACKAGE EDGE
0.10
+/-0.025 mm
T
GND SOLDER MASK OPENING WIDTH
2.00
+/-0.05 mm
S
GND SOLDER MASK OPENING LENGTH 3.80
+/-0.05 mm
R
DISTANCE BETWEEN GND SOLDER
MASK OPENING AND PACKAGE EDGE
0.10 +/-0.1
mm
Q
DISTANCE BETWEEN GND SOLDER
MASK OPENING AND PACKAGE EDGE
1.00 +/-0.1
mm
e
TERMINAL PITCH FOR TERMINAL 1-10,
2-9, 3-8, 4-7 AND 5-6
3.400
mm
e1
TERMINAL PITCH FOR TERMINAL 1-2-3-
4-5 AND 6-7-8-9-10
0.850
mm
Side View
Note:
GND SOLDER MASK OPENING IS NOT CENTERED ON THE PACKAGE
Top View
6
7
8
9
10
5
4
3
2
Pin 1
Bottom View
6
7
9
10
8
3
5
4
2
1
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Data Sheet: Subject to change without notice
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
12
Package Marking

713019
YYWW
XXXX
6
7
9
10
8
5
2
1
3
4
Bottom View
Top View


WHITE INK OR LASER MARK
Line 1: Part Number: 713019
Line 2: YYWW = Year and Work Week
Line 3: XXXX = TriQuint assembly lot number
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
13
Tape & Reel




PART
FEATURE
SYMBOL SIZE (in) SIZE (mm)
LENGTH A0
0.171
4.35
WIDTH B0
0.171
4.35
DEPTH K0
0.071
1.80
CAVITY
PITCH P1
0.315
8.00
CAVITY TO PERFORATION
LENGTH DIRECTION
P2 0.079
2.00
DISTANCE
BETWEEN
CENTERLINE
CAVITY TO PERFORATION
WIDTH DIRECTION
F 0.217
5.50
COVER TAPE
WIDTH
C
0.362
9.20
CARRIER TAPE
WIDTH
W
0.472
12.00













Data Sheet: Subject to change without notice
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
14




SOIC-8, QSOP 16, MSOP 08 & 10, TSSOP 16,
HP VFQFP-N 4X4 & 5X5, VQFN-24, VQFN-20. Modules
4X4
13" REEL
PART
FEATURE
SYMBOL SIZE (in) SIZE (mm)
DIAMETER A
12.992
330
THICKNESS W2
0.717
18.2
FLANGE
SPACE BETWEEN FLANGE
W1
0.504
12.8
OUTER DIAMETER
N
4.016
102.0
ARBOR HOLE DIAMETER
C
0.512
13.0
KEY SLIT WIDTH
B
0.079
2.0
HUB
KEY SLIT DIAMETER
D
0.787
20.0


MODULE 4X4
User Direction of Feed
Data Sheet: Subject to change without notice
Reel Quantity = 2500 units
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
For additional information and latest specifications, see our website:
www.triquint.com
Rev. D, March 2005
15


Additional Information
1
T
1 For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint:
Web:
H
www.triquint.com
H
Tel: (503) 615-9000
Email: info_wireless@tqs.com
Fax: (503) 615-8902
For technical questions and additional information on specific applications:
Email:
info_wireless@tqs.com
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this
information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the
circuits described herein are implied or granted to any third party.
TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems.
Copyright 2004 TriQuint Semiconductor, Inc. All rights reserved.
Data Sheet: Subject to change without notice