Preliminary Information

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Preliminary Information

RF Power Amplifier (PA) Bias Controller

X9470

FEATURES

· Programmable Bias Controller IC for Class A and

AB LDMOS Power Amplifiers

· Adaptive System on Chip Solution
· Bias Current Calibration to better than ±4%

using Reference Trim DCP

· Automatic Bias Point Tracking and Calibration

-- I

Sensing and Tracking

--Programmable Instrumentation Amplifier to

Scale Wide Range of I

--Programmable Gate Bias Driver
--All Programmable settings are Nonvolatile
--All Settings Recalled at Power Up.

· 28V Maximum V

· 2 Wire Interface for Programming Bias Setting

and Optimizing I

Set Point

· Bias Level Comparator
· Shutdown Control pin for PA Signal
· Slave address to allow for multiple devices
· 24-pin TSSOP Package
· Applications: Cellular Base Stations (GSM,

UMTS, CDMA, EDGE), TDD applications, Point-
to-multipoint, and other RF power transmission
systems

DESCRIPTION

The Xicor X9470 RF PA Bias Controller contains all of
the necessary analog components to sense the PA
drain current through an external sense resistor and
automatically control the gate bias voltage of an
LDMOS PA. The external sense resistor voltage is
amplified by an instrumentation amplifier and the out-
put of the amplifier along with an external reference
voltage is fed to the inputs of a comparator. The com-
parator output indicates which direction the LDMOS
gate bias voltage will move in the next calibration
cycle. System calibration is accomplished by enabling
the X9470 and providing a clock to the SCL pin. The
LDMOS drain current can be maintained constant over
temperature and aging changes by periodic calibra-
tion. The VOUT pin can be used to monitor the aver-
age power by tracking the drain current. Up to eight
X9470 or additional Xicor Digital Potentiometers can
be controlled via a two-wire serial bus.

TYPICAL APPLICATION

VCC

VSS

V+

AGND

Comparator

choke

RF PA in

SENSE

REF

SENSE+

BIAS

INC/DEC

Instrumentation

Amplifier

OUT

SENSE

REF

SHDN

EEPROM

SCL

SDA

Vbias

control

VREF
control

I2C

interface

Control &

Status Registers

out

REF

BIAS

FILTER

BIAS (Unbuffered)

RF Impedance

Matching

BULK

Class A Example

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Preliminary Information

X9470

PIN CONFIGURATION

ORDERING INFORMATION

PIN DESCRIPTIONS

Part Number

Temperature Range

Package

X9470V24I

-40°C TO 85°C

24-Lead TSSOP

TSSOP pin

Symbol

Brief Description

SENSE+

Positive sense voltage input terminal

REF

Upper Terminal of Potentiometer, called the R

REF

potentiometer. The voltage applied to this pin will determine the

upper voltage limit of the adjustment for the Up/Down threshold of the comparator.

REF

Lower Terminal of Potentiometer, called the R

REF

potentiometer. The voltage applied to this pin will determine the

lower voltage limit of the adjustment for the Up/Down threshold of the comparator.

REF

Wiper Terminal of Potentiometer, called the R

REF

potentiometer. The voltage on this pin will be the threshold for

the Up/Down comparator. Also referred to as the V

REF

of the comparator.

AGND

Analog ground to allow single point grounding external to the package to minimize digital noise.

VSS

System (Digital) Ground Reference

Chip Select. This input enables bias calibration adjustments to the R

BIAS

potentiometer. CMOS input with internal

pull-down.

SCL

Dual function. Function 1: The increment control input. Increments or decrements the R

BIAS

potentiometer.

Function 2: Serial Data Clock Input. Requires external pull-up.

SDA

Serial Data Input. Bi-directional 2-wire interface. Requires external pull-up.

BIAS

Upper Terminal of Potentiometer, called the R

BIAS

potentiometer. The voltage applied to this pin will determine the

upper limit of the bias voltage to the PA (or V

BIAS

pin).

BIAS

Wiper Terminal of Potentiometer, called the R

BIAS

potentiometer. This voltage is the equivalent to the unbuffered

voltage that will appear at the V

BIAS

pin.

BIAS

Lower Terminal of Potentiometer, called the R

BIAS

potentiometer. The voltage applied to this pin will determine the

lower limit of the bias voltage to the PA (or V

BIAS

pin).

External address pin which allows for a hardware slave address selection of this device.
This pin has an internal pull-down.

VSS

System (Digital) Ground Reference

BIAS

This is the bias output voltage pin and is used to drive the filter network to the PA gate.

System (Digital) Supply Voltage

V +

Positive voltage supply for the instrumentation amplifier and other analog circuits.

OUT

Instrumentation Amplifier output that is 20x or 50x the voltage across the Rsense pins.

INC/DEC

Status output that indicates the state of the comparator. When this pin is HIGH, the RBIAS potentiometer will in-
crement; when the pin is LOW, the RBIAS potentiometer will decrement. This pin is open drain and requires ex-
ternal resistor pull-up.

SHDN

Shutdown the output op amp. When SHDN is active (HIGH), the V

BIAS

pin is pulled LOW.

SENSE-

Negative sense voltage Input terminal

OUT

REF

V+

TSSOP

X9470

sense+

sense-

REF

VSS

AGND

SHDN

INC/DEC

BIAS

SDA

SCL

BIAS

VSS

BIAS

24
23

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Preliminary Information

X9470

ABSOLUTE MAXIMUM RATINGS*

Voltage on V+ (referenced to AGND)....................... 7V
Voltage on VCC (reference to VSS)......................... 7V
Voltage on all RH, RW, RL pins

(reference to AGND): ........................................... 7V

Voltage on Vsense+ or

Vsense- (reference to AGRND).......................... 30V

Voltage on SDA, CS, SCL, SHDN

(reference to AGND) ............... -0.3V to (Vcc + 0.3V)

Current into Output Pin:

..........................................±

5mA

Continuous Power Dissipation:........................ 500mW
Operating Temperature range: ...............-40

C to +85

Junction Temperature:........................................... 150

Storage Temperature......................... -65

C to +150

Lead Temperature (Soldering, 10 seconds): ..... 300

*COMMENT

Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device.
This is a stress rating only and the functional operation
of the device at these or any other conditions above
those listed in the operational sections of this specifi-
cation is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect
device reliability.

ELECTRICAL CHARACTERISTICS
INSTRUMENTATION AMPLIFIER

Recommended Operating Conditions: (Vcc, V+ = 4.75 to 5.25V; Vsense+, Vsense- = 26V; T

= -40°C to +85°C,

unless otherwise noted.)

Symbol

Parameter

Limits

Test Conditions/Notes

Min. Typ. Max. Units

(10)

Common Mode Input Voltage on
V

SENSE+

and V

SENSE-

pins

Gain 1

Gain from V

SENSE

to V

OUT

(2)

V/V

Measured with Status
Register bit SR0=0

Gain 2

Gain from V

SENSE

to V

OUT

(2)

V/V

Measured with Status
Register bit SR0=1

RANGE1

Differential voltage sense range be-
tween V

SENSE+

and V

SENSE-

for gain 1

Gain = 20

RANGE2

Differential voltage sense range be-
tween V

SENSE+

and V

SENSE-

for gain 2

Gain = 50

Input Offset Voltage

0.5

SENSE

= 40mV to 90mV

= 25°C

Av1

Gain 1 Error
Gain = 20 (4)

1.5

SENSE

= 60mV to 90mV

= 25 to 85°C, Gain = 20

Av2

Gain 2 Error
Gain = 50 (4)

1.5

SENSE

= 40mV to 60mV

= 25 to 85°C, Gain = 50

Avt1

Total Error, Gain 1
Gain = 20 (5)

-6

1.5

SENSE

= 60mV to 90mV

= 85°C, Gain = 20

SENSE

= 60mV to 90mV

= 25 to 85°C, Gain = 20

Avt2

Total Error, Gain 2
Gain = 50 (5)

-6

1.5

SENSE

= 40mV to 60mV

= 85°C, Gain = 50

SENSE

= 40mV to 60mV

= 25 to 85°C, Gain = 50

Long Term Drift

Avt1 or Avt2

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Preliminary Information

X9470

COMPARATOR
Recommended Operating Conditions: (Vcc, V+ = 4.75 to 5.25V; Vsense+, Vsense- = 26V; T

= -40°C to +85°C, unless

otherwise noted.)

(10)

Slew Rate of Instrumentation Amp

0.2

V/µS

SENSE

= 20mV step,

Cout = 10pF Measured at
V

OUT

(1,3)

settle

(10)

Setting time of Instrumentation Amp

5.0

µS

SENSE

= 20mV step, Cout =

10pF, settling to 1% of final value
Measured at V

OUT

(1,3)

CMRR

Common Mode Rejection Ratio

For both Gain 1 and Gain 2

PSRR

Power Supply Rejection Ratio

For both Gain 1 and Gain 2

OUT

Range

OUT

Voltage Swing

0.3

1.8

Gain = 20

0.3

3.0

Gain = 50

OUT

Noise

(10)

OUT

Voltage Noise, rms

Gain = 20

VSENSE

(10)

SENSE+

, V

SENSE-

Input Bias

Current

250

µA

= 25°C

VSENSE

(10)

SENSE+

, V

SENSE-

Input

Capacitance

Each Input

Symbol

Parameter

Limits

Test Conditions/Notes

Min.

Typ.

Max. Units

VOL

Output Voltage Low on the

INC/DEC

0.4

IOL = 1mA

(10)

Output sink Current

INC/DEC

pin, open drain

Vos

(10)

Input Hysteresis

Vcc = 5 V

Tpd

(10)

Response Time for propagation delay

µS

INC/DEC

pin with 2K

pull up

VREF DCP CIRCUIT BLOCK
Recommended Operating Conditions: (Vcc, V+ = 4.75 to 5.25V; Vsense+, Vsense- = 26V; T

= -40°C to +85°C,

unless otherwise noted.)

Symbol

Parameter

Limits

Test Conditions/Notes

Min.

Typ.

Max.

Units

TOTAL

End to End Resistance

Number Taps or Positions

REF

Terminal Voltage

AGND

= 0V

REF

Terminal Voltage

AGND

= 0V

REF

Terminal Voltage

AGND

= 0V

Power Rating

(10)

2.5

TOTAL

=10 K

ELECTRICAL CHARACTERISTICS
INSTRUMENTATION AMPLIFIER (CONTINUED)
Recommended Operating Conditions: (Vcc, V+ = 4.75 to 5.25V; Vsense+, Vsense- = 26V; T

= -40°C to +85°C,

unless otherwise noted.)

Symbol

Parameter

Limits

Test Conditions/Notes

Min. Typ. Max. Units

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X9470

BIAS ADJUSTMENT DCP CIRCUIT BLOCK
Recommended Operating Conditions: (Vcc, V+ = 4.75 to 5.25V; Vsense+, Vsense- = 26V; T

= -40°C to +85°C, unless

otherwise noted.)

Resolution

(10)

1.6

Absolute Linearity

(6)

-0.2

+0.2

(8)

Relative Linearity

(7)

-0.2

+0.2

(8)

TOTAL

Temperature Coefficient

(10)

±300

ppm/°C

Ratiometric Temperature Coefficient

(10)

-20

+20

ppm/°C

(10)

Potentiometer Capacitances on RH

REF

and RL

REF

Symbol

Parameter

Limits

Test Conditions/Notes

Min.

Typ.

Max.

Units

TOTAL

End to End Resistance Variation

with ±20% variation

Number Taps or Positions

256

Voltage at the RH

BIAS

Terminal Voltage

AGND

= 0V

Voltage at the RL

BIAS

Terminal Voltage

AGND

= 0V

Voltage at the RW

BIAS

Terminal Voltage

AGND

= 0V

Power Rating

(10)

2.5

TOTAL

=10 K

Resolution

(10)

0.4

Absolute Linearity

(6)

-1.0

+1.0

(8)

Relative Linearity

(7)

-1.0

+1.0

(8)

TOTAL

Temperature Coefficient

(10)

±300

ppm/°C

Ratiometric Temperature Coefficient

(10)

-50

ppm/°C

(10)

Potentiometer Capacitances on RH

BIAS

and RL

BIAS

VBIAS OUTPUT VOLTAGE FOLLOWER
Recommended Operating Conditions: (Vcc, V+ = 4.75 to 5.25V; Vsense+, Vsense- = 26V; T

= -40°C to +85°C,

unless otherwise noted.)

Symbol

Parameter

Limits

Test Conditions/Notes

Min.

Typ.

Max.

Units

Input Offset Voltage

OSDRIFT

(10)

Offset Voltage Temperature
Coefficient

µV/°C

= -40 to +85°C

Output Slew Rate on

BIAS

0.5

µS

= 10k

, 1nF, V

BIAS

20mV

BIAS

Voltage Output Swing

1.5

0.5

OUT

= ±10mA

VREF DCP CIRCUIT BLOCK
Recommended Operating Conditions: (Vcc, V+ = 4.75 to 5.25V; Vsense+, Vsense- = 26V; T

= -40°C to +85°C,

unless otherwise noted.)

Symbol

Parameter

Limits

Test Conditions/Notes

Min.

Typ.

Max.

Units

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Preliminary Information

X9470

D.C. OPERATING CHARACTERISTICS
Recommended Operating Conditions: (Vcc, V+ = 4.75 to 5.25V; Vsense+, Vsense- = 26V; T

= -40°C to +85°C, unless

otherwise noted.)

Notes: (1) V

OUT

is a high impedance output intended for light loads only.

(2) Gain at V

OUT

is set to 20 by default.

(3) Value given is for V

OUT

. The V

BIAS

output will depend on the V

BIAS

potentiometer which is initially loaded with a zero value, then

followed by the loading of the final value from E

memory.

(4) Gain Error excludes the contribution of the input offset voltage error
(5) Total Error includes the contributions of gain error and input offset voltage error.
(6) Absolute Linearity is utilized to determine actual wiper voltage versus expected voltage = (V

w(n)

(actual) V

w(n)

(expected))

(7) Relative Linearity is a measure of the error in step size between taps = V

W(n+1)

w(n)

+ Ml]

(8) 1 Ml = Minimum Increment = R

TOT

/63 or R

TOT

/255.

(9) Typical values are for T

= 25°C and nominal supply voltage, VCC = 5V

(10) This parameter is not 100% tested.

(10)

Settling Time

µs

Final value ±1%, R

= 10k

1nF,

BIAS

= 20mV

SHDN

Time for

SHDN

pin (delay) valid

0.1

1.0

µs

PSRR

Power Supply Rejection Ratio

VCC supply V

= 4.75 to

5.25V

Input Voltage Range

1.5

0.5

(10)

Load Capacitance

(10)

Capacitances on Shutdown Pin

OUT

(10)

Output Impedance

at 5MHz, 1nF load

Symbol

Parameter

Limits

Units

Test Conditions

Min.

Typ.

Max.

CC1

(9)

V+ Active Current

= V

0.3V, and SCL

@ max. t

CYC, SDA =

0.3V, SHDN inactive

CC2

(9)(10)

Active Current

(9)

Standby Supply Current
(V

, V+)

1.5

= V

, and SCL inactive

(no clock)

, SDA =

, SHDN

active

CS, SDA, SCL, SHDN RH, RL, RW,
INC/DEC VOUT, Input Leakage

-10

µA

= VSS to V

(10)

CS, SDA, SCL, SHDN, A0, A1, A2
HIGH Voltage

x 0.7

+ 0.5

(10)

CS, SDA, SCL, SHDN, A0, A1, A2
LOW Voltage

0.5

x 0.3

(10)

CS, SDA, SCL, SHDN, A0, A1, A2
Capacitance

= 5V, V

= VSS,

= 25°C, f = 1MHz

VBIAS OUTPUT VOLTAGE FOLLOWER
Recommended Operating Conditions: (Vcc, V+ = 4.75 to 5.25V; Vsense+, Vsense- = 26V; T

= -40°C to +85°C,

unless otherwise noted.)

Symbol

Parameter

Limits

Test Conditions/Notes

Min.

Typ.

Max.

Units

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Preliminary Information

X9470

BIAS ADJUSTMENT CIRCUIT BLOCK

A.C. OPERATING CHARACTERISTICS
Recommended Operating Conditions: (Vcc, V+ = 4.75 to 5.25V; Vsense+, Vsense- = 26V; T

= -40°C to +85°C, unless

otherwise noted.)

A.C. TIMING

Note:

(11) MI in the A.C. timing diagram refers to the minimum incremental change in the V

BIAS

output due to a change in the wiper position.

Symbol

Parameter

Limits

Units

Min.

Typ.

(9)

Max.

to SCL Setup

100

Vsense Change to

INC/DEC

Change

µs

SCL LOW Period

1.5

µs

SCL HIGH Period

1.5

µs

(10)

SCL Inactive to

Inactive

100

(10)(11)

SCL to

BIAS

Change

µs

CYC

SCL Cycle Time

µs

(10)

SCL Input Rise and Fall Time

500

SCL

INC/DEC

BIAS

CYC

10%

90%

(Vsense+

Vsense-)

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Preliminary Information

X9470

AC SPECIFICATIONS

Note:

(12) Cb = total capacitance of one bus line in pF.

TIMING DIAGRAMS

Bus Timing

Symbol Parameter

Min.

Max.

Unit

SCL

SCL Clock Frequency

400

kHz

(10)

Pulse width Suppression Time at inputs

(10)

SCL LOW to SDA Data Out Valid

0.1

0.9

µs

BUF

(10)

Time the bus must be free before a new transmission can start

1.3

µs

LOW

Clock LOW Time

1.3

µs

HIGH

Clock HIGH Time

0.6

µs

SU:STA

Start Condition Setup Time

0.6

µs

HD:STA

Start Condition Hold Time

0.6

µs

SU:DAT

Data In Setup Time

200

HD:DAT

Data In Hold Time

200

SU:STO

Stop Condition Setup Time

0.6

µs

(10)

Data Output Hold Time

(10)

SDA and SCL Rise Time

20 +.1Cb

(12)

300

(10)

SDA and SCL Fall Time

20 +.1Cb

(12)

300

(10)

Capacitive load for each bus line

400

SU:STO

HIGH

SU:ST

HD:STA

HD:DAT

SU:DAT

SCL

SDA IN

SDA OUT

LOW

BUF

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Preliminary Information

X9470

Write Cycle Timing

Power Up Timing

Note:

Delays are measured from the time V

is stable until the specified operation can be initiated. These parameters are not 100% tested.

Proper recall of stored wiper setting requires a V

power-up ramp that is monotonic and with noise or glitches < 100mV. It is important

to correctly sequence voltages in an LDMOS amplifier circuit. For the X9470 typical application, the V

, then V+ pins should be pow-

ered before the V

of the LDMOS to prevent LDMOS damage. Under no circumstances should the V

be applied to the LDMOS

device before V

and V+ are applied to the X9470.

DCP Default Power-up Tap Positions (shipped from factory)

Nonvolatile Write Cycle Timing

Note:

is the time from a valid stop condition at the end of a write sequence to the end of the self-timed internal nonvolatile write cycle. It is

the minimum cycle time to be allowed for any nonvolatile write by the user, unless Acknowledge Polling is used.

Symbol Parameter

Min.

Max.

Unit

(10)

Power-up rate

0.2

V/ms

VREF DCP

Bias Adjust DCP

Symbol Parameter

Min.

Typ.

(1)

Max.

Unit

(10)

Write Cycle Time

SCL

SDA

8th Bit of Last Byte

ACK

Stop

Condition

Start

Condition

Preliminary Information

Preliminary Information

X9470

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DETAILED PIN DESCRIPTIONS

Supply Pins

Digital Supplies VCC, VSS

The positive power supply and ground for the DCP dig-
ital control sections. VSS is normally tied to digital
ground. The X9470 is provided with separate digital
and analog power supply pins to better isolate digital
noise from the analog section.

Analog Supplies V+, AGND

The positive analog supply and ground for the Instru-
mentation Amplifier (IA). The analog supply ground is
kept separate to allow an external single point connec-
tion. V+ can be a separate supply voltage from VCC, or
VCC can be filtered before connection to V+.

Bias Adjustment Circuit Block Pins

BIAS

, RL

BIAS

, and RW

BIAS

for

VBIAS Adjust-

ments.

These pins are the connections to a Xicor Digitally
Controlled Potentiometer (XDCP

) or R

BIAS

potenti-

ometer. RH

BIAS

is connected to the most positive refer-

ence, and the RL

BIAS

is connected to the least positive

reference voltage. The potentiometer has a resolution
of 256-taps and typical R

TOTAL

of 10kohm. So for

example, to provide 4mV resolution, the voltage differ-
ence applied to the RH

BIAS

and RL

BIAS

pins must be

1.024V. The RW

BIAS

value can be stored in non-vola-

tile memory and recalled upon power up.

Serial Clock (SCL).

This is a dual function input pin. The state of the CS pin
determines the functionality.

Function 1:

SCL

is a negative edge-triggered control

pin of the R

BIAS

potentiometer. Toggling

SCL

will

either increment or decrement the wiper in the
direction indicated by the logic level on the INC/DEC
pin. CS must be high for this function.

Function 2: SCL is the serial bus clock for serial bus
interface. CS must be low for this function.

Chip Select (CS). Calibration Enable.

The CS input is the enable bias adjustments. When the
CS is HIGH (enabled) and a SCL pulse is present, the
wiper position on the R

BIAS

potentiometer will auto-

matically update with either an increment or decrement
of one tap position according to INC/DEC signal from
the comparator.

When CS is LOW (disabled), the wiper counter of the
XDCP will hold the last wiper position until CS is
enabled again and the wiper position is updated.

INC/DEC Monitor Pin

The Up or Down Monitor pin (INC/DEC) indicates the
state of the comparator. This signal indicates that the
Instrumentation Amplifier output voltage is higher or
lower than the voltage level set by the RW

REF

pin. The

output is used to indicate the direction that the gate
bias voltage needs to move to reach the target bias
voltage.

Sense and Scale Block Pins

SENSE+

and V

SENSE-

These are the input pins to the IA circuit. These pins
are used to determine the change in voltage across the
the external drain sense resistor of an RF power ampli-
fier.

REF

, RL

REF

, and RW

REF

. PA Bias Set Point.

The PA Bias reference voltage is controlled by a 64-tap
(10k ohm typical R

TOTAL

) potentiometer, called the

REF

potentiometer. The voltages applied to RH

REF

and RL

REF

will determine the range of adjustment of

the reference voltage level (VREF) for the Comparator.
The resolution of the comparator reference is the differ-
ence of the voltages applied to RH

REF

and RL

REF

divided by 63. The position of the wiper (RW

REF

) is

controlled via serial bus. The RW

REF

value can be

stored in non-volatile memory and recalled upon power
up.

REF

is also an input signal used as a scaling volt-

age (VREF) to set the appropriate I

of an RF power

amplifier. V

REF

can be derived from an external voltage

divider or from a baseband processor or similar micro-
controller. V

REF

can be set permanently or changed

dynamically using the potentiometer for various PA
operating points.

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Preliminary Information

X9470

OUT

This pin is the output of the IA, which reflects a 20x or
50x gain of the input signal (voltage across the Vsense
pins). It can be used to indicate the magnitude of the
drain current envelope when RF is present.

Output Block Pins

BIAS

The V

BIAS

is the gate bias voltage output. It is buffered

with a unity gain amplifier and is capable of driving 1nF
(typical) capacitive loads.

This pin is intended to be connected through an RF fil-
ter to the gate of an LDMOS power transistor. The volt-
age of V

BIAS

is determined by the XDCP's value of the

BIAS

resistor.

Other Pins

SHDN

SHDN is an input pin that is used to shutdown the
V

BIAS

output voltage follower. When the SHDN pin is

HIGH, the V

BIAS

pin is pulled to VSS. When the device

is shutdown, the current R

BIAS

wiper position will be

maintained in the wiper counter register. When shut-
down is disabled, the wiper returns to the same wiper
position before shutdown was invoked. Note that when
the device is taken out of shutdown mode (SHDN goes
from HIGH to LOW), the CS input must be cycled once
to enable calibration.

SDA

Serial bus data input/output. Bi-directional. External
pullup is required.

A0, A1, A2

Serial bus slave address pins. These pins are used to
defined a hardware slave address. This will allow up to
8 of the X9470's to be shared on one two-wire bus.
These are useful if several X9470's are used to control
the bias voltages of several LDMOS Power Transistors
in a single application. Default hardware slave address
is "000" if left unconnected due to internal pull-down
resistor.

TYPICAL APPLICATION

The X9470 can be used along with a microprocessor
and transmit control chips to control and coordinate
FET biasing (see Figure 1). The CS, SCL, and SDA
signals are required to control the X9470 Bias Adjust-
ment Circuit Block. An internal R

WREF

voltage is pro-

vided via a programmable voltage divider between the
RH

REF

and RL

REF

pins and is used to set the voltage

reference of the comparator. The shutdown (SHDN)
and bias voltage indicators (INC/DEC) are additional
functions that offer FET control, monitoring, and pro-
tection.

Typically, the closed loop setup of the X9470 allows for
final calibration of a power amplifier at production test.
The CS and SCL pins are used to perform this calibra-
tion function. Once in a base station, the amplifier can
then be re-calibrated any time that there is no RF sig-
nal present. The bias setting block can also be used
open loop to adjust gate bias or can be shutdown
using the SHDN pin. The sense and scale block can be
used for amplifier power monitoring diagnostics as
well.

The range of the drain bias current operating point of
the LDMOS FET is set by an external reference across
the reference potentiometer. The wiper of the potenti-
ometer sets the trip point for comparison with V

, the

amplified voltage across R

SENSE

, the drain resistor.

The output of the comparator causes the R

BIAS

poten-

tiometer to increment or decrement automatically on
the next SCL clock cycle. This R

BIAS

potentiometer is

configured as a voltage divider with a buffered wiper
output which drives the gate voltage of an external
LDMOS FET.

Once the optimum bias point is reached, the R

BIAS

value is latched into a wiper counter register. Again,
the V

BIAS

gate voltage can be updated continuously or

periodically depending on the system requirements.

Both terminals of the R

BIAS

potentiometer are access-

ible and can be driven by external reference voltages
to achieve a desired I

vs. gate voltage resolution, as

well as supporting temperature compensation circuitry.

In summary, the X9470 provides full flexibility on set-
ting the operating bias point and range of an external
RF power amplifier for GSM, EDGE, UMTS, CDMA or
other similar applications.

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X9470

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Figure 1. Typical Application

X9470 FUNCTIONAL DESCRIPTION

This section provides detail description of the following:

Sense and Scale Block Description

Bias Adjustment Control Block Description

Output Block Description

Bias Adjustment and Storage Description

SENSE AND SCALE BLOCK

The Sense and Scale Circuit Block (Figure 2) implements
an instrumentation amplifier whose inputs (V

SENSE+

and

SENSE-

) are across an external sense resistor in the

drain circuit of an RF Power FET. V

SENSE+

is connected

to V

, the drain voltage source for the RF power FET,

and V

SENSE-

pin is connected to the other end the exter-

nal sense resistor.

An internal instrumentation amplifier (IA) will sense the
V and amplify it by a gain factor of K

(see Equation

1). The resulting output is compared with V

REF

at the

comparator. V

REF

can be a fixed reference voltage or

adjusted by using the 64-tap digital potentiometer. The
output of the comparator is used to increment or decre-
ment the R

BIAS

potentiometer in the Bias Adjustment

Circuit Block. The gain factor K

is designed such that

the Sense and Scale Block will set the Bias Adjustment
Circuit Block to operate in a given voltage range (mV)
vs. drain current adjustment (mA).

The output of the IA is also available at the pin Vout to
enable drain current monitoring. The gain at Vout is
fixed at a factor of K

, lower than K

so that high I

currents will not cause saturation of the Vout signal.
The equation for Vout is given as:

BIAS ADJUSTMENT CIRCUIT BLOCK

There are three sections of this block (Figure 3): the
input control, counter and decode section (1), the
resistor array (2); and the non-volatile register (3). The
input control section operates just like an up/down
counter. The input of the counter is driven from the out-
put of the comparator in the Sense and Scale Block
and is clocked by the SCL signal. The output of this
counter is decoded to select one of the taps of a 256-
tap digital potentiometer.

VCC

VSS

V+

AGND

Comparator

choke

RF PA in

SENSE

REF

SENSE+

BIAS

INC/DEC

Instrumentation

Amplifier

OUT

SENSE

REF

SHDN

EEPROM

SCL

SDA

Vbias

control

VREF
control

I2C

interface

Control &

Status Registers

out

REF

BIAS

FILTER

BIAS (Unbuffered)

RF Impedance

Matching

BULK

Class A Example

REF

* R

SENSE

is fixed 50x for the internal comparator input.

(1)

V = I

* R

SENSE

OUT

= K

is fixed to 20x for the Vout pin

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Preliminary Information

X9470

Figure 2. Sense and Scale Block Diagram

The wiper of the digital potentiometer acts like its
mechanical equivalent and does not move beyond the
last position. That is, the counter does not wrap around
when clocked to either extreme. The electronic
switches in the potentiometer operate in a "make
before break" mode when the wiper changes tap posi-
tions. If the wiper is moved several positions, multiple
taps are connected to the wiper for t

(SCL to

BIAS

change).

When the device is powered-up, the X9470 will load
the last saved value from the non-volatile memory into
the WCR. Note that the current wiper position can be
saved into non-volatile memory register by using the
SCL and CS pins as shown in Figure 4.

Important note: the factory setting of the wiper counter
register is the ZERO-position (0 of 255 taps). This is
the default wiper position.

Bias Adjustment Block Instructions and Program-
ming. The SCL, INC/DEC (internal signal) and CS
inputs control the movement of the wiper along the
resistor array. (See Table 1) With CS set HIGH, the
device is selected and enabled to respond to the INC/
DEC and SCL inputs. HIGH to LOW transitions on SCL
will increment or decrement R

BIAS

(depending on the

state of the INC/DEC input). The INC/DEC input is
derived from the output of the comparator of the Sense
and Scale Block.

Storing Bias Resistor Values in Memory. Wiper val-
ues are stored to VOLATILE memory automatically
when CS is HIGH and INC/DEC either transitions from
HIGH to LOW or from LOW to HIGH. Wiper values are
stored to NON-VOLATILE memory during Byte Write
or as described in the following section.

Table 1. Mode Selection

* When coming out of shutdown, the CS pin must be cycled once before bias
adjustment is enabled.

INC/DEC

REF

OUT

SENSE+

SENSE

10k

64-tap

REF

Comparator

INC/DEC

~1kohm

Precision

I-Amp

Cint~2pF ±10%

}

RF
PA
Out

choke

gate

RF PA in

= 20X

= 50X

SDA

CS*

SCL

INC /

DEC

Mode

VBIAS is incremented
one tap position.

VBIAS is decremented
one tap position.

Lock Wiper Position.
Save to volatile
memory. (BiasLockTM)

Open Loop.

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Figure 3. Bias Adjustment Block Diagram

NON-VOLATILE STORE OF THE BIAS POSITION

The following procedure will store the values for the
Rref and Rbias wiper positions in Non-Volatile memory.
This sequence is intended to be performed after a
BiasLock calibration sequence to simplify storage. If
BiasLock has not been achieved, then the Rbias wiper
position may change when the CS pin is brought high
and SCL begins clocking. See Figure 4 for the actual
sequence.

1. Set the WEL bit with a write command (02h to regis-

ter 0Fh)

2. Peform a calibration and achieve BiasLock. Leave

CS pin high.

3. Write the address byte only (START, followed by

device/slave address and a 0 for a write, see page
20).

4. Perform a STOP command.
5. With SCL still low, bring the CS low. The falling edge

of the CS will initiate the NV write.

The WEL bit may be reset afterwards to prevent further
NV writes.

INC/DEC FUNCTION

The INC/DEC pin is an open-drain logic output that
tracks the activity of the increment/decrement compar-
ator. A logic HIGH at INC/DEC indicates that the I

did not rise up to the desired setting indicated by V

REF

while a logic LOW at the INC/DEC pin indicates that
the IDQ is higher than the desired setting.

INC/DEC is used as an internal control signal as well.
As an example, when INC/DEC is LOW, the Bias
Adjustment Circuit Block will start to move the Rbias
resistor wiper towards the RL

BIAS

terminal end when

CS is HIGH and SCL is clocking. Consequently, the
V

BIAS

voltage will decrease, and the I

decreases to

meet the desired V

REF

setting.

The INC/DEC signal can also be used to detect a dam-
aged RF power FET. For instance, If INC/DEC stays
HIGH during and after a calibration sequence it may
indicate that the RF power FET has failed. This indica-
tor can also be used with a level sense on the V

OUT

to perform diagnostics.

SHUTDOWN MECHANISM

This hardware control shutdown pin (SHDN) will pull
the voltage of V

BIAS

to VSS with an internal pull down

resistor. When shutdown is disabled (V

BIAS

is active

when SHDN is LOW), the V

BIAS

voltage will move to

the previous desired bias voltage.

It will take less than a microsecond to enable the inter-
nal output buffer depending on the loading condition at
the V

BIAS

pin.

Gate Bias
Op Amp

BIAS

Legend

External pin/signal

Internal node/signal

SCL

BIAS

(unbuffered)

BIAS

SHDN

to LDMOS gate

10Kohm
256-tap

BIAS

INC

U/D

INC/DEC

XDCP

Memory and Control

WCR (Rbias)

Bias Register

non-volatile

Power On Recall

(POR)

Note:

1) WCR = Wiper Control Register

INC/DEC is logic HIGH or LOW
from Sense/Scale Block
and is used to increment or
decrement the Rbias resistor
(XDCP) to adjust the gate voltage.

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Preliminary Information

X9470

OUTPUT (V

BIAS

)

BIAS

is a buffered output of RW

BIAS

(wiper output). It

can deliver a high current for driving up to typically 1nF
capacitive loading with stable performance and fast
settling time.

A single pole filter should be placed in between the
V

BIAS

output and the RF input signal to isolate any

high frequency noise.

Figure 4. Non-Volatile Store of the Bias Position

X9470 PRINCIPLES OF OPERATION

The X9470 is a Bias Controller that contains all the
necessary analog components for closed-loop DC bias
control of LDMOS Transistors in RF Applications. The
X9470 provides a mechanism to periodically set DC
bias operating points of Class A or AB-type amplifiers
to account for V

drift and temperature variations.

The following is an example of X9470 operation.

The X9470 incorporates an instrumentation amplifier,
comparator and buffer amplifier along with resistor
arrays and their associated registers and counters. The
serial interface provides direct communication between
the host and the X9470. This section provides a
detailed example of how the X9470 can be used to cal-
ibrate and dynamically set the optimum bias operating
point of an RF power amplifier (see Figure 5):

State 0: Power on Monitor Mode

State 1: DC-bias Setting When No RF is Present

[Calibration]

State 2: Calibration Disable When RF is Present

State 3: PA Standby Mode. Dynamic Adjustment for

drift and Temperature variation

State 4: Power Off (Shutdown) Mode [Turn off the

Power Amplifier]

State 0: Monitor Mode

The V

OUT

and INC/DEC outputs of the X9470 can be

used for monitoring and diagnostic purposes. Since
V

OUT

has a lower gain (20x, default) than the internal IA

output, it can handle higher drain sense current while
keeping the output below the rail. This allows normal PA
power monitoring, and over-current sensing using an
external comparator. The INC/DEC pin can be moni-
tored during calibration to see if there is no change,
which indicates LDMOS functional problems. Note that
the INC/DEC status is also available in the status regis-
ter for software status reads.

State 1: DC-bias Setting When No RF is Present
[Calibration]

At calibration, the DC bias operating point of the
LDMOS Power Amplifier must be set. As soon as the
Bias Adjustment Circuit Block is enabled (CS enabled,
SDA high, and SCL pulse provided), the X9470 will
automatically calibrate the external Power Amplifier by
continually sampling the drain current of the external
Power Amplifier and make adjustments to the gate
voltage of the amplifier (See Figure 6).

Initiates
high voltage write
cycle

Stored in
Non-volatile
memory

SCL

SDA

Non-volatile Write of R

BIAS

and R

REF

value Using SDA, SCL and CS pins

BIAS

non-volatile register

Set WEL

bit

Calibration

and Bias Lock

Set

Address Byte

Stop

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Figure 5. Operating modes X9470

When no RF signal is present, the instrumentation
amplifier of the X9470 senses the drain current as a
voltage drop,

V, across an external drain R

sense

resis-

tor. The

V is amplified and compared to an external

scaling voltage, V

REF

. Any difference between

V and

REF

results in a resistive increment or decrement of

the internal R

BIAS

potentiometer.

The R

BIAS

potentiometer is used as a voltage divider

with the RH

BIAS

and RL

BIAS

terminals setting the

upper and lower voltage limits of the unbuffered
RW

BIAS

voltage. The resolution of the R

BIAS

potenti-

ometer resistor is 0.4% of the difference of voltage
across the RH

BIAS

and RL

BIAS

terminals. The R

TOTAL

is typically 10K

with 256-taps. So, for example, if the

difference between the RH

BIAS

and RL

BIAS

terminals

is 1.024V, then the step accuracy is 4mV.

The voltage at the RW

BIAS

pin is then fed into the

BIAS

voltage follower. The V

BIAS

pin is a buffered out-

put that is used to drive the gate of an LDMOS transis-
tor.

The scaling voltage, V

REF

, set by the R

REF

potentiom-

eter, sets the calibrated operating point of the LDMOS
Amplifier.

On edge transitions of the INC/DEC signal, the X9470 will
latch the current wiper position--this is known as "Bias
LockTM" mode. This is shown in Figure 6. When BiasLock
occurs, the comparator hysteresis will allow INC/DEC to
change state only after the IA output changes by more
than 20mV. This will prevent toggling of the V

BIAS

output

unless the drain bias current is constantly changing.

State 2: DC-bias Disable When RF is Present
(optional)

When an RF signal is present, the X9470 is put into
standby mode (open loop). The X9470 is in standby
mode when the CS pin is disabled so that the R

BIAS

potentiometer holds the last wiper position. The pres-
ence of an RF signal at the input of a Class A or AB
amplifier increases the current across the R

sense

resis-

tor. Over a period of time, the temperature of the
LDMOS also increases and the LDMOS also experi-
ences V

drift. Therefore the DC biasing point that

was set during State 1 (calibration) is not optimal.
Adjustments to the gate voltage will need to be made
to optimize the operation of the LDMOS PA. This is
done in State 3.

Choose Vref to scale IDQ, perform calibration,

State 1

State 2

State 3

State 4

Transmit Mode

Calibration Mode

Standby Mode

Off Mode

Disable Bias Adjustment,

Recalibrate bias point for drift and temperature.

Rbias resistor will automatically increment or decrement
for optimal operating point continuously

Turn off PA

Latch bias point for DC bias current in wiper counter

PA Enabled, Vout and INC/DEC Monitored for status

State 0

Monitor Mode

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Preliminary Information

X9470

State 3: PA Standby Mode, DC Bias Adjustment
[Compensation for V

Drift and Temperature

Variation]

When the Power Amplifier is in Standby Mode the
X9470 allows for dynamic adjustment of the DC bias-
ing point to take into account both V

drift and tem-

perature variation. Dynamic biasing is achieved with
the X9470 by using the CS, and SCL pins. For exam-
ple, the SCL pin can be a steady clock and the CS pin
can be used as a control signal to enable/disable the
Bias Adjustment Block.

Figure 6 illustrates how the X9470 can be used for
dynamic biasing. Upon the presence of an RF signal,
the CS pin is pulled LOW. This will prevent the X9470
from changing the V

BIAS

voltage during I

peak cur-

rents. Once the RF signal is no longer present, the CS
pin can be enabled (closed loop), SDA high and the
X9470 Bias Adjustment Circuit moves the V

BIAS

volt-

age (the gate voltage of the FET) to meet the average
I

bias point for optimum amplifier performance.

State 4: Power Off Mode

During power saving or power-off modes the X9470
can be shut down via the SHDN pin. This pin pulls the
output of the V

BIAS

pin LOW.

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Preliminary Information

X9470

Figure 6. Dynamic Biasing Technique: Automatic DC Bias Operating Point Adjustment

State 0

Monitor

Mode

State 1

Calibration

(no RF present)

State 2

RF present

State 3

Recalibrate bias

point for drift

and temperature

State 4

shut

down

Set Operating Range Scale for Bias Adjustment

RF signal

REF

SCL

INC/DEC

SHDN

BIAS

bias

default is

zero point of R

total

Latch R

bias

DC point

in calibration vs V

REF

RF present
Turn off
Bias
Adjustment

bias

increase/decrease

after RF present due to
temperature increase &
V

-threshold drift

IDQ vs. gate
voltage bias
optimized

Shut

down

BiasLock

Saves wiper position to

volatile memory

Bias Adjustment ON

Bias Adjustment OFF

Bias Adjustment ON

Automatic Bias Adjustment

BiasLock

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Preliminary Information

X9470

X9470 STATUS REGISTER (SR) AND CONTROL REGISTER (CR) INFORMATION

Table 2. Status Register (SR)

STATUS REGISTER (SR)

The Status Register is located at address 0F<hex>.
This is a register used to control the write enable
latches, and monitor status of the SHDN, INC/DEC,
and CS pin. This register is separate from the Control
Register.

SR7: SHDN: Vbias SHDN Flag. Read Only--Volatile.
The bit keeps status of the shutdown pin, SHDN. When
this bit is HIGH, the SHDN pin is active and the V

BIAS

output is disabled. When this bit is LOW, the SHDN pin
is low and V

BIAS

output is enabled.

SR6: INC/DEC : Read Only--Volatile. This bit keeps
status of the INC/DEC pin. When this bit is HIGH the
counter is in increment mode, when this bit is LOW the
counter is in decrement mode.

SR4: CS: Read Only--Volatile. This bit keeps status
on the CS pin. When this bit is HIGH, the X9470 is in
closed loop mode (Rbias adjustment enabled). When
this bit is LOW the x9470 is in open loop mode (no
Rbias adjustments).

SR2, SR3, SR5: Read only

For internal test usage, should be set to 0 during SR
writes.

SR1: WEL: Write Enable Latch--Volatile

The WEL bit controls the access to the registers during
a write operation. This bit is a volatile latch that powers
up in the LOW (disabled) state. While the WEL bit is
set LOW, Nonvolatile writes to the registers will be
ignored, and all writes to registers will be volatile. The
WEL bit is set by writing a "1" to the WEL bit and
zeroes to the other bits of the Status Register. Once
this write operation is completed and a STOP com-
mand is issued, nonvolatile writes will then occur for all
NOVRAM registers and control bits. Once set, the,
WEL bit remains set until either reset to 0 (by writing a
"0" to the WEL bit and zeroes to the other bits of the
Status Register) or until the part powers up again.

SR0: Gain - NOVRAM

Selects V

OUT

and IA gain. When SR0=0, V

OUT

gain=20x,

IA gain=50x. When SR0=1, V

OUT

gain=50x, and IA

gain=20x. Default setting is 0.

CONTROL REGISTERS (CR)

The control registers are organized for byte operations.
Each byte has a unique byte address as shown in
Table 3 below.

Table 3. Control Registers (CR)

Note:

02H to 0EH are reserved for internal manufacturing use.

Byte

Addr

SR7

SR6

SR5

SR4

SR3

SR2

SR1

SR0

0F hex

SHDN

INC/DEC

WEL

Gain

Byte

Addr.

<HEX>

Description

Reg

Name

Bit

Memory Type

00 hex

DCP for Vbias

Vbias

Vb7

Vb6

Vb5

Vb4

Vb3

Vb2

Vb1

Vb0

NOVRAM

01 hex

DCP for

VREF

Vref

Vr5

Vr4

Vr3

Vr2

Vr1

Vr0

NOVRAM

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X9470 BUS INTERFACE INFORMATION

Figure 7. Slave Address, Word Address, and Data Bytes - Write Mode

Figure 8. Slave Address, Word Address, and Data Bytes - Read Mode

Slave Address, Byte Address, and Data Byte

The byte communication format for the serial bus is
shown in Figures 7 and 8 above. The first byte, BYTE
0, defines the device indentifier, 0101 in the upper half;
and the device slave address in the low half of the byte.
The slave address is determined by the logic values of
the A0, A1, and A2 pins of the X9470. This allows for
up to 8 unique addresses for the X9470. The next byte,
BYTE 1, is the Byte Address. The Byte Address identi-
fies a unique address for the Status or Control Regis-
ters as shown in Table 3. The following byte, Byte 2, is
the data byte that is used for READ and WRITE opera-
tions.

Start Condition

All commands are preceded by the start condition,
which is a HIGH to LOW transition of SDA when SCL is
HIGH. The device continuously monitors the SDA and
SCL lines for the start condition and will not respond to
any command until this condition has been met. See
Figure 9.

Slave Address Byte

Byte 0

Data Byte

Byte 2

R/W=0

Device Identifier

Byte Address

Byte 1

Slave Address

0Fh : SR

00h : V

BIAS

01h : V

REF

Slave Address Byte

Byte 0

Data Byte

Byte 2

R/W

Device Identifier

Data Byte

Byte 1

Slave Address

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Preliminary Information

X9470

Stop Condition

All communications must be terminated by a stop con-
dition, which is a LOW to HIGH transition of SDA when
SCL is HIGH. The stop condition is also used to place
the device into the Standby power mode after a read
sequence. A stop condition can only be issued after the
transmitting device has released the bus. See Figure 9.

Acknowledge

Acknowledge is a software convention used to indicate
successful data transfer. The transmitting device, either
master or slave, will release the bus after transmitting
eight bits. During the ninth clock cycle, the receiver will
pull the SDA line LOW to acknowledge that it received
the eight bits of data. Refer to Figure 10.

The device will respond with an acknowledge after rec-
ognition of a start condition and if the correct Device
Identifier and Select bits are contained in the Slave
Address Byte. If a write operation is selected, the
device will respond with an acknowledge after the
receipt of each subsequent eight bit word. The device
will acknowledge all incoming data and address bytes,
except for:

The Slave Address Byte when the Device Identifier

and/or Select bits are incorrect

The 2nd Data Byte of a Status Register Write Opera-

tion (only 1 data byte is allowed)

Figure 9. Valid Start and Stop Conditions

Figure 10. Acknowledge Response From Receiver

Figure 11. Valid Data Changes on the SDA Bus

SCL

SDA

Start

Stop

SCL from

Master

Data Output

from Transmitter

Data Output

from Receiver

Start

Acknowledge

SCL

SDA

Data Stable

Data Change

Data Stable

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WRITE OPERATIONS

Byte Write

For a write operation, the device requires the Slave
Address Byte and the Word Address Bytes. This gives
the master access to any one of the words in the array.
Upon receipt of each address byte, the X9470
responds with an acknowledge. After receiving the
address bytes the X9470 awaits the eight bits of data.
After receiving the 8 data bits, the X9470 again
responds with an acknowledge. The master then termi-
nates the transfer by generating a stop condition. The
X9470 then begins an internal write cycle of the data to
the nonvolatile memory. During the internal write cycle,
the device inputs are disabled, so the device will not
respond to any requests from the master. The SDA out-
put is at high impedance. See Figure 12.

A write to a protected block of memory is ignored, but
will still receive an acknowledge. At the end of the write
command, the X9470 will not initiate an internal write
cycle, and will continue to ACK commands.

Stops and Write Modes

Stop conditions that terminate write operations must
be sent by the master after sending at least 1 full data
byte and it's associated ACK signal. If a stop is issued
in the middle of a data byte, or before 1 full data byte +
ACK is sent, then the X9470 resets itself without per-
forming the write. The contents of the array are not
affected.

Acknowledge Polling

Disabling of the inputs during nonvolatile write cycles
can be used to take advantage of the typical 5ms write
cycle time. Once the stop condition is issued to indi-
cate the end of the master's byte load operation, the

X9470 initiates the internal nonvolatile write cycle.
Acknowledge polling can begin immediately. To do this,
the master issues a start condition followed by the
Slave Address Byte for a write or read operation. If the
X9470 is still busy with the nonvolatile write cycle then
no ACK will be returned. When the X9470 has com-
pleted the write operation, an ACK is returned and the
host can proceed with the read or write operation.
Refer to the flow chart in Figure 15.

READ OPERATIONS

There are three basic read operations: Current
Address Read, Random Read, and Sequential Read.

Current Address Read

Internally the X9470 contains an address counter that
maintains the address of the last word read incre-
mented by one. Therefore, if the last read was to
address n, the next read operation would access data
from address n+1. On power up, the address is initial-
ized to 0h. In this way, a current address read immedi-
ately after the power on reset can download the entire
contents of memory starting at the first location. Upon
receipt of the Slave Address Byte with the R/W bit set
to one, the X9470 issues an acknowledge, then trans-
mits eight data bits. The master terminates the read
operation by not responding with an acknowledge dur-
ing the ninth clock and issuing a stop condition. Refer
to Figure 13 for the address, acknowledge, and data
transfer sequence.

Preliminary Information

23 of 25

REV 11.16 3/20/03

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Preliminary Information

X9470

Figure 12. Byte Write Sequence

Figure 13. Current Address Read Sequence

Figure 14. Random Address Read Sequence

r
t

o
p

Data

A
C
K

SDA Bus

Signals From

The Slave

Signals from

the Master

A
C
K

Byte

Address 0

Slave

Address

Device

r
t

o
p

Data

A
C
K

SDA Bus

Signals from

the Slave

Signals from the

Master

Slave

Address

Device

A
C
K

r
t

o
p

Data

r
t

SDA Bus

Signals from

the Slave

Signals from the

Master

Byte

Address 0

A
C
K

Slave

Address

Device

A
C
K

Slave

Address

Device

A
C
K

Preliminary Information

Preliminary Information

X9470

24 of 25

REV 11.16 3/20/03

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Figure 15. Acknowledge Polling Sequence

It should be noted that the ninth clock cycle of the read
operation is not a "don't care." To terminate a read
operation, the master must either issue a stop condi-
tion during the ninth cycle or hold SDA HIGH during
the ninth clock cycle and then issue a stop condition.

Random Read

Random read operations allows the master to access
any location in the X9470. Prior to issuing the Slave
Address Byte with the R/W bit set to zero, the master
must first perform a "dummy" write operation.

The master issues the start condition and the slave
address byte, receives an acknowledge, then issues
the word address bytes. After acknowledging receipt of
each word address byte, the master immediately
issues another start condition and the slave address
byte with the R/W bit set to one. This is followed by an
acknowledge from the device and then by the eight bit
data word. The master terminates the read operation
by not responding with an acknowledge and then issu-
ing a stop condition. Refer to Figure 13 for the address,
acknowledge, and data transfer sequence.

In a similar operation called "Set Current Address," the
device sets the address if a stop is issued instead of
the second start shown in Figure 14. The X9470 then
goes into standby mode after the stop and all bus
activity will be ignored until a start is detected. This
operation loads the new address into the address
counter. The next Current Address Read operation will
read from the newly loaded address. This operation
could be useful if the master knows the next address it
needs to read, but is not ready for the data.

ACK

returned?

Issue Slave

Address Byte

(Read or Write)

Byte load completed

by issuing STOP.

Enter ACK Polling

Issue STOP

Issue START

YES

Issue STOP

Continue normal

Read or Write

command
sequence

PROCEED

YES

nonvolatile write
Cycle complete.

Continue command

sequence?

Preliminary Information

Characteristics subject to change without notice.

25 of 25

LIMITED WARRANTY

Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty,
express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement.
Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices
at any time and without notice.

Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, or licenses are implied.

TRADEMARK DISCLAIMER:

Xicor and the Xicor logo are registered trademarks of Xicor, Inc. AutoStore, Direct Write, Block Lock, SerialFlash, MPS, BiasLock and XDCP are also trademarks of
Xicor, Inc. All others belong to their respective owners.

U.S. PATENTS

Xicor products are covered by one or more of the following U.S. Patents: 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846;
4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976; 4,980,859; 5,012,132; 5,003,197; 5,023,694; 5,084,667; 5,153,880; 5,153,691;
5,161,137; 5,219,774; 5,270,927; 5,324,676; 5,434,396; 5,544,103; 5,587,573; 5,835,409; 5,977,585. Foreign patents and additional patents pending.

LIFE RELATED POLICY

In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection
and correction, redundancy and back-up features to prevent such an occurrence.

Xicor's products are not authorized for use in critical components in life support devices or systems.

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to

perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life

support device or system, or to affect its safety or effectiveness.

REV 11.16 3/20/03

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Preliminary Information

X9470

PACKAGING INFORMATION

NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)

24-Lead Plastic, TSSOP Package Type V

.169 (4.3)

.177 (4.5)

.252 (6.4) BSC

.026 (.65) BSC

.303 (7.70)

.311 (7.90)

.002 (.06)

.005 (.15)

.047 (1.20)

.0075 (.19)

.0118 (.30)

See Detail "A"

.031 (.80)

.041 (1.05)

° 8°

.010 (.25)

.020 (.50)

.030 (.75)

Gage Plane

Seating Plane

Detail A (20X)

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